Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
S2GOSECURITYOPTIGAXTOBO1 IR (Infineon Technologies)	EVAL S2GO SECURITY	15
SHIELDBTS70061EPPTOBO1 IR (Infineon Technologies)	BTS7006-1EPP SHIELD FOR ARDUINO	3
SHIELDBTS500101TADTOBO1 IR (Infineon Technologies)	12V PROTECTED SWITCH SHIELD FOR	3
S2GOMEMSMICIM69DTOBO1 IR (Infineon Technologies)	BOARD	208
IRID9670TPM20LINUXTOBO1 IR (Infineon Technologies)	EVAL SLB9670 TPM2.0 RASPBERRYPI	126
S2GOHALLTLE49643MTOBO1 IR (Infineon Technologies)	TLE4964-3M HALL SENSE SHIELD2GO	3
S2GOSECURITYOPTIGAETOBO1 IR (Infineon Technologies)	EVAL TRUST X SECURITY CHIP	3
KIT40WAMPHATZWTOBO1 IR (Infineon Technologies)	MERUS AUDIO AMP WIFI KIT	79
KITA2GTC375ARDSBTOBO1 IR (Infineon Technologies)	AURIX SHIELDBUDDYTC375 DEV KIT	4
SHIELDBTS70081EPPTOBO1 IR (Infineon Technologies)	BTS7008-1EPP SHIELD FOR ARDUINO	3
BLDCSHIELDTLE9879TOBO1 IR (Infineon Technologies)	EVAL TLE9879QXA40 BLDC MOTOR	90
BTF3080EJDEMOBOARDTOBO1 IR (Infineon Technologies)	BTF3080EJ DEMOBOARD	5
BTF3050EJDEMOBOARDTOBO1 IR (Infineon Technologies)	BTF3050EJ DEMOBOARD	5
BTS72002EPADAUGHBRDTOBO1 IR (Infineon Technologies)	PROFET +2 12V BTS7200-2EPA DAUG	6
BTS70802EPADAUGHBRDTOBO1 IR (Infineon Technologies)	PROFET +2 12V BTS7080-2EPA DAUGH	3
BTS70122EPADAUGHBRDTOBO1 IR (Infineon Technologies)	PROFET +2 12V BTS7012-2EPA DAUG	3
BTS70401EPADAUGHBRDTOBO1 IR (Infineon Technologies)	PROFET +2 12V BTS7040-1EPA DAUGH	3
SHIELDBTS70021EPPTOBO1 IR (Infineon Technologies)	BTS7002-1EPP SHIELD FOR ARDUINO	30
IRIDIUMSLM9670TPM20TOBO1 IR (Infineon Technologies)	EVAL IRIDIUM SLM 9670 RASPBERRY	17
IRIDIUM9645TPMI2CTOBO1 IR (Infineon Technologies)	EVAL SLB9645 TPM1.2 RASPBERRYPI	10

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems