Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
4464

4464

Adafruit

ICM-20649 6DOF STEMMA QT / QWIIC

11

2926

2926

Adafruit

TERMINAL BLOCK BREAKOUT FEATHERW

190

4869

4869

Adafruit

CIRCUIT PLAYGROUND 200X200 TRI-C

0

2315

2315

Adafruit

PITFT 320X240 2.2 TFT

68

2327

2327

Adafruit

SERVO HAT FOR RASPBERRY PI MINI

38

3848

3848

Adafruit

5V 1.8A ISOLATED OUTPUT POE MODU

117

4537

4537

Adafruit

NEOPXL8 FOR FEATHER M4 - 8 X DMA

18

4534

4534

Adafruit

BONSAI BUCKAROO PLANT CARE HELPE

52

2262

2262

Adafruit

RASPBERRY PI MODEL B GPIO REF

0

4418

4418

Adafruit

SONY SPRESENSE EXTENSION BOARD

0

4461

4461

Adafruit

BINHO FEATHER / STEMMA QT BOARD

0

4114

4114

Adafruit

ZERO2GO OMINI MULTI-CH PWR SUPPL

0

493

493

Adafruit

KIT LED MATRIX LOL SHIELD BLUE A

0

4496

4496

Adafruit

FEATHER CLICK SHIELD

0

1148

1148

Adafruit

HALF-SIZE PERMA-PROTO RASPBERRY

0

286

286

Adafruit

KIT LED MATRIX LOL SHIELD GRN A

0

3289

3289

Adafruit

AUTOMATION HAT FOR RASPB PI

0

3248

3248

Adafruit

MICRO DOT PHAT W/LED MODULES RED

0

3580

3580

Adafruit

PIMORONI UNICORN HAT HD

0

3374

3374

Adafruit

DEVELOPMENT INTERFACE

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
RFQ BOM Call Skype Email
Top