Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
4351

4351

Adafruit

INFINEON TRUST M STEMMA QT QWIIC

48

2928

2928

Adafruit

8-CHANNEL PWM OR SERVO FEATHERWI

47

4566

4566

Adafruit

AHT20 - TEMPERATURE & HUMIDITY S

0

3346

3346

Adafruit

I2S 3W STEREO SPEAKER AMP BONNET

132

4369

4369

Adafruit

PCT2075 STEMMA QWIIC TEMP SENSOR

63

4074

4074

Adafruit

RFM95W 915MHZ LORA RADIO BONNET

65

4438

4438

Adafruit

LSM6DSOX 6 DOF STEMMA QWIIC

20

1906

1906

Adafruit

PIXY CMUCAM5 SENSOR

0

2864

2864

Adafruit

ADAFRUIT NEOPIXEL SHIELD - 40 RG

4

4646

4646

Adafruit

9-DOF ABSOLUTE ORIENTATION IMU F

187

4367

4367

Adafruit

CIRCUIT PLAYGROUND TFT GIZMO

58

4775

4775

Adafruit

ADAFRUIT METRO ESP32-S2

0

4867

4867

Adafruit

ADAFRUIT SCD-30 - NDIR CO2 TEMPE

0

4440

4440

Adafruit

I2C OLED DISPLAY STEMMA QWIIC

565

4120

4120

Adafruit

8X16 CHARLIEPLEX LED GREEN

0

3298

3298

Adafruit

ZERO4U 4 PORT USB HUB PI ZERO

360

2616

2616

Adafruit

TOUCHSCREEN TFT 320X240 3.2

2

4122

4122

Adafruit

8X16 CHARLIEPLEX LED WARM WHITE

8

4073

4073

Adafruit

RFM69HCW 433MHZ RADIO BONNET

22

3464

3464

Adafruit

JOY BONNET FOR RASPBERRY PI

12

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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