Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
P0057

P0057

Terasic

HSMC DEBUG LOOPBACK CONN

18

P0078

P0078

Terasic

HSMC COMMUNICATION CARD

1

P0083

P0083

Terasic

HDMI RECEIVER DAUGHTER CARD

1

P0185

P0185

Terasic

HMI TOUCHSCREEN 2.4" COLOR

166

P0024

P0024

Terasic

GPIO-HSTC CARD (FEMALE)

10

P0001

P0001

Terasic

MODULE DIGITAL CAMERA 5MP (D5M)

14

P0087

P0087

Terasic

HDMI-HSTC CARD (VER.1.4)

2

P0096

P0096

Terasic

APTINA SENSOR ADAPTER HSMC CARD

0

P0204

P0204

Terasic

DAUGHTER CARD HSMC ARRADIO

4

P0498

P0498

Terasic

12G SDI-FMC DAUGHTER CARD

2

P0189

P0189

Terasic

BOARD DEV DE0 DAUGHTER

0

P0531

P0531

Terasic

OCXO TIMING BOARD

0

P0504

P0504

Terasic

TIMING AND UART BOARD

0

P0038

P0038

Terasic

DAUGHTER BOARD FOR DE3/HSMC

0

CLT

CLT

Terasic

CAMERA LINK TX DAUGHTER BOARD

0

CLR

CLR

Terasic

CAMERA LINK RX DAUGHTER BOARD

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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