Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
P0060 Terasic	INDUSTRIAL COMMUNICATION BOARD	1
P0431 Terasic	HDMI-FMC CARD	5
P0481 Terasic	NET-FMC CARD	5
P0007 Terasic	DAUGHTER BOARD AD/DA GPIO ADA	5
P0003 Terasic	DAUGHTER BOARD AD/DA HSMC ADA	11
P0040 Terasic	SFP HSMC DEV BOARD	3
P0092 Terasic	DUAL XAUI TO SFP HSMC CARD	0
P0053 Terasic	SATA/SAS HSMC CARD	1
S0463 Terasic	VITA FMC LOOPBACK BOARD	8
P0447 Terasic	D8M-GPIO 8MP DIGITAL CAMERA PACK	3
P0033 Terasic	BOARD ADAPTER HSMC TO GPIO	54
P0017 Terasic	DVI-HSMC CARD	9
P0449 Terasic	8 MEGA PIXEL DIGITAL CAMERA PACK	3
P0499 Terasic	RFS DAUGHTER CARD	1
P0052 Terasic	XTS-HSMC CARD	7
P0079 Terasic	CAMERA LINK RECEIVER HSMC CARD	1
S0485 Terasic	FMC+ LOOPBACK BOARD	1
P0084 Terasic	HDMI TRANSMITTER DAUGHTER CARD	1
P0039 Terasic	SDI-HSMC CARD	3
P0035 Terasic	CARD AD/DA DATA CONVERSION	13

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems