Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
4570 Adafruit	DS1841 I2C DIGITAL 10K POTENTIOM	40
PIS-1284 Pi Supply	OCTOPUS ADKEYPAD	30
104990583 Seeed	5 INCH TFT DISPLAY FOR SIPEED TA	1
MIKROE-3613 MikroElektronika	H-BRIDGE 3 CLICK	7
DFR0270 DFRobot	ACCESSORY SHIELD FOR ARDUINO	2
MIKROE-2888 MikroElektronika	CAP TOUCH CLICK	4
IRID9670TPM12LINUXTOBO1 IR (Infineon Technologies)	EVAL SLB9670 TPM1.2 RASPBERRYPI	4
MIKROE-1586 MikroElektronika	BOARD ALCOHOL CLICK SENSOR	1
MIKROE-2399 MikroElektronika	BT AUDIO CLICK	1
MIKROE-4293 MikroElektronika	SRAM 3 CLICK	5
AST1032 TinyCircuits	0.96" OLED SCREEN WIRELING	11
114990831 Seeed	RASPBERRY PI HIGH-PRECISION AD/D	318
MIKROE-2221 MikroElektronika	DC MOTOR 4 CLICK	1
PPMB00113 Pimoroni	MOISTURE SENSOR FOR MICRO:BIT	0
MIKROE-3416 MikroElektronika	DC MOTOR 9 CLICK	11
X-NUCLEO-IHM17M1 STMicroelectronics	NUCLEO BRD STSPIN233 MOTOR DRVR	2
1411 Adafruit	PWM SERVO SHIELD 16CH 12BIT I2C	51
103100142 Seeed	GROVE SHIELD FOR PI PICO V1.0	0
U002 M5Stack	MINI INFRARED DISTANCE UNIT	84
410-117 Digilent, Inc.	PMODENC ROTARY ENCODER	27

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems