Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-4038 MikroElektronika	BT-EZ CLICK	4
DFR0643 DFRobot	GRAVITY: EASY RELAY MODULE	225
OM2NTA5332 NXP Semiconductors	NTAG 5 DEMO BOARD	10
SEN0137 DFRobot	DHT22 TEMPERATURE AND HUMIDITY S	178
MIKROE-3996 MikroElektronika	HEATER CLICK	7
DEV-14439 SparkFun	EXPANSION DOCK FOR ONION OMEGA	0
MIKROE-2047 MikroElektronika	DC MOTOR 3 CLICK	4
MIKROE-2036 MikroElektronika	HEART RATE 3 CLICK	6
P0053 Terasic	SATA/SAS HSMC CARD	1
MIKROE-2761 MikroElektronika	SECURE 3 CLICK	6
ASX00011 Genuino (Arduino)	ARDUINO MKR ENVIRONMENTAL SHIELD	57
MIKROE-4277 MikroElektronika	ZIGBEE CLICK	5
107020049 Seeed	GROVE - I2C FM RECEIVER V1.1	6
MIKROE-2708 MikroElektronika	FAN 2 CLICK	0
ASD2005-R-T TinyCircuits	PROTOTERMINAL INCLUDED NOTSOLDER	0
A000110 Genuino (Arduino)	ARDUINO 4 RELAYS SHIELD	166
X-NUCLEO-IHM16M1 STMicroelectronics	THREE-PHASE BRUSHLESS DC MOTOR D	23
BTT3018EJDEMOBOARDTOBO1 IR (Infineon Technologies)	BTT3018EJ DEMOBOARD	3
105990072 Seeed	GEAR STEPPER MOTOR DRIVER PACK	16
DFR0024 DFRobot	GRAVITY: DS18B20 TEMPERATURE SEN	16

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems