Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-1941 MikroElektronika	CLICK BOARD 6DOF IMU 6AXIS	8
PPMB00130 Pimoroni	AMP:BIT CLASS D AMPLIFIER FOR MI	0
MIKROE-3019 MikroElektronika	BRUSHLESS 4 CLICK	4
104001000100 Industrial Shields	OPENMOTE B IOT SENSOR BOARD	3
MIKROE-2334 MikroElektronika	ATA6563 CLICK	27
ICE40-IO Olimex	EXTENSION MODULE FOR ICE40HX1K-E	0
P0431 Terasic	HDMI-FMC CARD	5
MD-42688-P-XB TDK InvenSense	EXPANSION BOARD FOR SMARTBUG MOD	33
410-245 Digilent, Inc.	PMODDA4 8-CH 12-BIT DAC MODULE	34
SEN-16476 SparkFun	SPARKFUN QWIIC MICROPRESSURE SEN	132
BOB-15932 SparkFun	SPARKFUN QWIIC BUTTON - RED LED	162
BOOSTXL-TLC6948EVM Texas Instruments	LAUNCHPAD BOOSTER PACK	1
MIKROE-1507 MikroElektronika	BOARD	72
DFR0021-B DFRobot	GRAVITY: DIGITAL BLUE LED LIGHT	0
KIT-5601B Pimoroni	EDGE CONNECTOR BREAKOUT BOARD FO	0
101020600 Seeed	GROVE - I2C UV SENSOR (VEML6070)	15
MIKROE-2886 MikroElektronika	TEMP-LOG CLICK	0
111020001 Seeed	GROVE ENCODER	36
EVAL-AD7983-PMDZ Analog Devices, Inc.	EVAL BOARD 16BIT ADC AD7983	1
MIKROE-1526 MikroElektronika	DEV BOARD DC MOTOR	1

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems