Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
4480 Adafruit	LSM6DS33 6-DOF ACCEL + GYRO IMU	29
MAX33012ESHLD# Maxim Integrated	CAN TRANSCEIVER WITH +/-65V FP,	223
DEV-14034 SparkFun	SPECTACLE AUDIO BOARD	0
113030008 Seeed	WIFI SHIELD V2.0	0
MIKROE-4081 MikroElektronika	AD-SWIO CLICK	3
SEN-15892 SparkFun	ZIO QWIIC LOUDNESS SENSOR	14
DPP904R000 TE Connectivity Measurement Specialties	RASPBERRY PI WEATHER SHIELD	25
MIKROE-1446 MikroElektronika	CAPSENSE CLICK	0
DEV-14356 SparkFun	PI-TOPPROTO	0
X-NUCLEO-NFC03A1 STMicroelectronics	NUCLEO BOARD CR95HF NFC	32
A014-C M5Stack	M5GO BATTERY BOTTOM2(FOR CORE2 O	0
MIKROE-3134 MikroElektronika	NDIR CO2 CLICK	4
101020192 Seeed	GROVE - BAROMETER SENSOR	145
BOOSTXL-SHARP128 Texas Instruments	DEVELOPMENT SPECIALIZED	30148
103030215 Seeed	CANBUS SHIELD V2	801
MIKROE-2395 MikroElektronika	NFC CLICK	6
SEN-14571 SparkFun	TRIPLE AXIS MAGNETOMETER BREAKOU	39
MIKROE-4441 MikroElektronika	NVSRAM CLICK	5
113020009 Seeed	GROVE BLE (DUAL MODEL)	0
CAM009 Pimoroni	160 (FISHEYE) NIGHT VISION CAMER	30

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems