Accessories

Image Part Number Description / PDF Quantity Rfq
28060

28060

Parallax, Inc.

BREADBOARD ADAPTER PS/2

0

28325

28325

Parallax, Inc.

EXPANDER DB-TO-SIP BASIC STAMP

0

32362

32362

Parallax, Inc.

CARD BLANK EXPERIMENTER HYDRA

0

27935

27935

Parallax, Inc.

CARD SRAM HYDRA XTREME 512K

0

27910

27910

Parallax, Inc.

LCD DISPLAY (2 X 16)SERIAL

0

27908

27908

Parallax, Inc.

EVAL BOARD TRACKBALL MODULE

0

28301

28301

Parallax, Inc.

DAUGHTERBOARD 3PIN I/O MOBO

0

27963

27963

Parallax, Inc.

SOLUTIONS CUBED: MEMKEY

0

32312

32312

Parallax, Inc.

ADAPTER MICRO-SD CARD

0

450-32360

450-32360

Parallax, Inc.

NES CONTROLLER SOCKET

0

32365

32365

Parallax, Inc.

GAMEPAD CONTROLLER

0

28825

28825

Parallax, Inc.

MINI SOUND PLAYER SOUNDPAL

0

28327

28327

Parallax, Inc.

DEV BOARD PROPELLER AUDIO VIDEO

0

28031

28031

Parallax, Inc.

ADAPTER USB TO SRL RS232 W/CABLE

0

805-00013

805-00013

Parallax, Inc.

WIR-CABL,68,3-CON,F-F,22AWG

0

800-00029

800-00029

Parallax, Inc.

WIRE PLUGGABLE MALE-FEM (1=10PK)

0

805-00014

805-00014

Parallax, Inc.

WIR-CABL,68,3-CON,F-X,26AWG

0

27983

27983

Parallax, Inc.

GAS SENSOR BOARD

0

27404

27404

Parallax, Inc.

COMPETITION RING FOR SUMOBOT

0

28050

28050

Parallax, Inc.

RCA TO BREADBOARD ADAPTER

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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