Accessories

Image Part Number Description / PDF Quantity Rfq
450-00310

450-00310

Parallax, Inc.

CONNECTOR SOCKET FOR P2 EDGE (ST

20

800-00060

800-00060

Parallax, Inc.

CABLE ASSY PARALLAX MOTHERBOARD

4

64020

64020

Parallax, Inc.

P2 EDGE MODULE BREADBOARD

11

800-00003

800-00003

Parallax, Inc.

CABLE SERIAL PROGRAMMING

0

27111

27111

Parallax, Inc.

ADAPTER BASIC STAMP 1 SERIAL

2

800-00040

800-00040

Parallax, Inc.

CABLE ASSY PARALLAX MOTHERBOARD

1

700-00056

700-00056

Parallax, Inc.

BENT WHISKERS

27

805-00019

805-00019

Parallax, Inc.

CABLE, USB A TO DC 2.1MM JACK

46

64018

64018

Parallax, Inc.

P2 EDGE 80-PIN ADAPTER KIT

8

32115

32115

Parallax, Inc.

JTAGULATOR

3

450-00308

450-00308

Parallax, Inc.

CONNECTOR SOCKET FOR P2 EDGE (RI

25

32201

32201

Parallax, Inc.

PLUG USB-SRL FOR PROPELLER CI

34

020-00001

020-00001

Parallax, Inc.

3 FUNCTION UNIVERSAL REMOTE

0

64006-ES

64006-ES

Parallax, Inc.

PROPELLER 2 ACCESSORY KIT

46

805-00006

805-00006

Parallax, Inc.

CABLE USB A TO MINI B

0

30014

30014

Parallax, Inc.

CARTRIDGE INK HP51604 BLACK

0

800-00080

800-00080

Parallax, Inc.

CABLE ASSY PARALLAX MOTHERBOARD

0

750-00001

750-00001

Parallax, Inc.

USB MAINS ADAPTER, 18W, 5V, 3A

50

64007

64007

Parallax, Inc.

P2 TO WX ADAPTER

15

350-90000

350-90000

Parallax, Inc.

STANDOFF LED 0.53 NY

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

RFQ BOM Call Skype Email
Top