Accessories

Image Part Number Description / PDF Quantity Rfq
UPPI1020GM-A-915EK

UPPI1020GM-A-915EK

Silicon Labs

UDP UPPI MCU CARD

0

UNIPROTOBOARD

UNIPROTOBOARD

Silicon Labs

UNIVERSITY PROTOTYPING BOARD

0

AB2

AB2

Silicon Labs

DAUGHTERCARD F020/040/060/120TB

0

ACDC9V-J

ACDC9V-J

Silicon Labs

ADAPTER AD/DC 9V 100MA JAPAN

0

ACDC9V-H

ACDC9V-H

Silicon Labs

ADAPTER AD/DC 9V 100MA HONG KONG

0

ACDC9V-A

ACDC9V-A

Silicon Labs

ADAPTER AD/DC 9V 100MA AUSTRALIA

0

C8051T600-EDB

C8051T600-EDB

Silicon Labs

BOARD DAUGHTER QFN C8051T60X

0

ACDC9V-U

ACDC9V-U

Silicon Labs

ADAPTER AD/DC 9V 100MA U.S.

0

ACDC9V-B

ACDC9V-B

Silicon Labs

ADAPTER AD/DC 9V 100MA U.K.

0

AB3

AB3

Silicon Labs

MODEM PROTOTYPINGBOARD

0

ACDC9V-T

ACDC9V-T

Silicon Labs

ADAPTER AD/DC 9V 100MA TAIWAN

0

SILINKPS-EVB

SILINKPS-EVB

Silicon Labs

DAUGHTER CARD PROSLIC PS

0

ACDC9V-K

ACDC9V-K

Silicon Labs

ADAPTER AD/DC 9V 100MA KOREA

0

SLEXB0001A

SLEXB0001A

Silicon Labs

EXPANSION BOARD HUM/TEMP/OPT

0

ACDC9V-E

ACDC9V-E

Silicon Labs

ADAPTER AD/DC 9V 100MA EUROPE

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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