Accessories

Image Part Number Description / PDF Quantity Rfq
UPIO-I2S-AUDIO-EK

UPIO-I2S-AUDIO-EK

Silicon Labs

BOARD DEV AUDIO I/O I2S UDP

0

UPIO-GLCD-SPI-EK

UPIO-GLCD-SPI-EK

Silicon Labs

UDP I/O BOARD

0

SLSDA001A

SLSDA001A

Silicon Labs

DEBUG ADAPT KIT

563

UPPIF960-A-EK

UPPIF960-A-EK

Silicon Labs

UDP UPPI MCU CARD

1

UPIO-M3U160-EK

UPIO-M3U160-EK

Silicon Labs

BOARD EXPANDER I/O CARD UDP

2

UP-BACKPLANE-01-EK

UP-BACKPLANE-01-EK

Silicon Labs

UDP BACKPLANE

0

MSC-RFP2EFM-NA

MSC-RFP2EFM-NA

Silicon Labs

KIT EFM32 SUITE

0

ISA-INTERFACE

ISA-INTERFACE

Silicon Labs

INTERFACE BOARD FOR ISA3

0

C8051T600EDB

C8051T600EDB

Silicon Labs

BOARD DAUGHTER FOR C8051T600E

0

TOOLSTICKDA

TOOLSTICKDA

Silicon Labs

TOOLSTICK DEBUG ADAPTER

0

MSC-RFP2EFM

MSC-RFP2EFM

Silicon Labs

BOARD ADAPTER EFM32 TO RF PICO

0

AB1

AB1

Silicon Labs

PROTO BOARD W/SRAM FOR C8051

0

UPPI1020GM-A-470EK

UPPI1020GM-A-470EK

Silicon Labs

UDP UPPI MCU CARD

0

EFM32-GXXX-PTB

EFM32-GXXX-PTB

Silicon Labs

BOARD PROTOTYPING FOR EFM32

0

SENSOR-EXP-EVB

SENSOR-EXP-EVB

Silicon Labs

SENSOR EXPANSION CARD EFM32

0

AB0

AB0

Silicon Labs

PROTOTYPING BOARD

0

C8051F700-TB

C8051F700-TB

Silicon Labs

BOARD PROTOTYPE WITH C8051F700

0

HRM-GGG-PS

HRM-GGG-PS

Silicon Labs

ACCY FOR BIOMETRIC-EXP-EVB

0

UPPI1024GM-A-868EK

UPPI1024GM-A-868EK

Silicon Labs

UDP UPPI MCU CARD

0

EC-SJ

EC-SJ

Silicon Labs

SERIAL CABLE 10PIN FOR SER ADAPT

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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