Accessories

Image Part Number Description / PDF Quantity Rfq
CAB-15

CAB-15

Analog Devices, Inc.

DEV KIT CABLE

0

CABLE-SMBUS-5PIN

CABLE-SMBUS-5PIN

Analog Devices, Inc.

DEV KIT CABLE

0

SOCKET-ADM106XTQZ

SOCKET-ADM106XTQZ

Analog Devices, Inc.

SOCKET FOR ADM106XTQZ

0

WB-802-8

WB-802-8

Analog Devices, Inc.

8 CHANNEL OUTPUT BRD

0

5BPROTO

5BPROTO

Analog Devices, Inc.

PROTO MECHANICAL MISC ASSEMBLIES

0

EVAL-SDP-INTERZ

EVAL-SDP-INTERZ

Analog Devices, Inc.

INTERPOSER FOR SDP & INERTIAL SE

1

ADZS-ENCODE-EX3

ADZS-ENCODE-EX3

Analog Devices, Inc.

BOARD EXTENDER VIDEO ENCODER EI3

0

ADZS-BFAV-EZEXT

ADZS-BFAV-EZEXT

Analog Devices, Inc.

BOARD DAUGHT ADSP-BF533,37,61KIT

0

AC2626M4

AC2626M4

Analog Devices, Inc.

PROBE TEMP 4" GENERAL PURP

0

USB-SMBUS-CABLEZ

USB-SMBUS-CABLEZ

Analog Devices, Inc.

CABLE SMBUS USB 3PIN

0

ADZS-CAM-EX3

ADZS-CAM-EX3

Analog Devices, Inc.

BOARD DEV EXT CAMERA EI3

0

ADZS-USBLAN-EZEXT

ADZS-USBLAN-EZEXT

Analog Devices, Inc.

BOARD DAUGHTER EXTENDED USB-LAN

0

AD-DAC-HSMC-ADP

AD-DAC-HSMC-ADP

Analog Devices, Inc.

BOARD ADAPTER FOR DPG2 ALTERA

0

AC2626K6

AC2626K6

Analog Devices, Inc.

PROBE TEMP 6" GENERAL PURP

0

ADZS-BFSHUSB-EZEXT

ADZS-BFSHUSB-EZEXT

Analog Devices, Inc.

BOARD DAUGHTER EZ EXTENDER

0

AC2626M6

AC2626M6

Analog Devices, Inc.

PROBE TEMP 6" GENERAL PURP

0

ADIS16IMU2/PCBZ

ADIS16IMU2/PCBZ

Analog Devices, Inc.

BREAKOUT BOARD ADIS16MU2

0

AC2626L4

AC2626L4

Analog Devices, Inc.

PROBE TEMP 4" GENERAL PURP

0

HSC-ADC-EVALB-DCZ

HSC-ADC-EVALB-DCZ

Analog Devices, Inc.

KIT EVAL ADC FIFO DUAL-CH USB HS

0

AC2626J6

AC2626J6

Analog Devices, Inc.

PROBE TEMP 6" GENERAL PURP

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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