Accessories

Image Part Number Description / PDF Quantity Rfq
ADZS-SHAUDIO-EZEXT

ADZS-SHAUDIO-EZEXT

Analog Devices, Inc.

SHARC AUDIO EZ-EXTENDER

2

ADS7-V2EBZ

ADS7-V2EBZ

Analog Devices, Inc.

EVAL BOARD HDV6/DPG3

21

HSC-ADC-EVALEZ

HSC-ADC-EVALEZ

Analog Devices, Inc.

EVAL PLATFORM HIGH SPEED ADC

0

AD-DAC-FMC-ADP

AD-DAC-FMC-ADP

Analog Devices, Inc.

BOARD ADAPTER FOR DPG2 XILINX

11

EVAL-CFTL-LVDT

EVAL-CFTL-LVDT

Analog Devices, Inc.

SENSOR LVDT E-100 ECONOMY SERIES

11

DC2510A

DC2510A

Analog Devices, Inc.

DEMO SHIELD BOARD FOR DC2321A

2

EVAL-FW-LPSK2

EVAL-FW-LPSK2

Analog Devices, Inc.

EVAL BOARD LPSK2

1

EVAL-FW-HPMFB2

EVAL-FW-HPMFB2

Analog Devices, Inc.

DAUGHTER BOARD HPMFB2

0

AC2626J4

AC2626J4

Analog Devices, Inc.

GENERAL PURPOSE PROBE IC

0

EVAL-FW-MOTHER

EVAL-FW-MOTHER

Analog Devices, Inc.

EVAL BOARD FW MOTHER

2

ADCMXL_BRKOUT/PCBZ

ADCMXL_BRKOUT/PCBZ

Analog Devices, Inc.

ADCMXLXX21 MODULE BREAKOUT BOARD

4

SDP-PMD-IB1Z

SDP-PMD-IB1Z

Analog Devices, Inc.

BOARD INTERPOSER PMOD TO SDP

17

USB-I2C/LIN-CONV-Z

USB-I2C/LIN-CONV-Z

Analog Devices, Inc.

USB TO I2C/LIN CONV BOARD

6

HSC-ADC-EVALCZ

HSC-ADC-EVALCZ

Analog Devices, Inc.

KIT EVAL ADC FIFO HI SPEED

32

ADIS16IMU1/PCBZ

ADIS16IMU1/PCBZ

Analog Devices, Inc.

BREAKOUT IMU INTERFACE BOARD

20

USB-SDP-CABLEZ

USB-SDP-CABLEZ

Analog Devices, Inc.

CABLE USB TO SRL I/O INTERFACE

43

DC2212A

DC2212A

Analog Devices, Inc.

THERMOCOUPLE BOARD

5

DC2214A

DC2214A

Analog Devices, Inc.

DEDICATED THERMISTOR BOARD

2

AC2626L6

AC2626L6

Analog Devices, Inc.

GENERAL PURPOSE PROBE IC

30

ADALM-UARTJTAG

ADALM-UARTJTAG

Analog Devices, Inc.

UART/JTAG ADAPTER AND CABLE

31

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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