Accessories

Image Part Number Description / PDF Quantity Rfq
PRT-14429

PRT-14429

SparkFun

QWIIC CABLE - 500MM

621

PRT-14311

PRT-14311

SparkFun

ESP32 STACKABLE HEADER SET

228

COM-09277

COM-09277

SparkFun

BUTTON PAD 2X2 - BREAKOUT PCB

0

PRT-17253

PRT-17253

SparkFun

MICRO:BIT EDGE CONNECTOR - SMD,

0

WIG-17264

WIG-17264

SparkFun

8BITDO SN30 PRO BLUETOOTH GAMEPA

24

PRT-14272

PRT-14272

SparkFun

RASPBERRY PI ZERO CAMERA CABLE

0

PRT-14275

PRT-14275

SparkFun

RASPBERRYPI GPIO MALE HEADER

166

PRT-11417

PRT-11417

SparkFun

ARDUINO STACKABLE HEADER KIT - R

1310

PRT-14322

PRT-14322

SparkFun

PHOTON STACKABLE HEADER - 12 PIN

0

CAB-17261

CAB-17261

SparkFun

FLEXIBLE QWIIC CABLE - FEMALE JU

4

DEV-13743

DEV-13743

SparkFun

SPARKFUN LEVEL SHIFTING MICROSD

70

SEN-16775

SEN-16775

SparkFun

OPENMV GLOBAL SHUTTER MODULE

38

PRT-14426

PRT-14426

SparkFun

QWIIC CABLE - 50MM

981

DEV-11235

DEV-11235

SparkFun

ARDUINO AND BREADBOARD HOLDER

0

KIT-14526

KIT-14526

SparkFun

PI ZERO USB STEM

14

PRT-14321

PRT-14321

SparkFun

PHOTON HEADER - 12 PIN FEMALE

164

KIT-15081

KIT-15081

SparkFun

QWIIC CABLE KIT

0

CAB-14988

CAB-14988

SparkFun

QWIIC CABLE FEMALE JUMPER 4PIN

413

SEN-16778

SEN-16778

SparkFun

OPENMV ULTRA WIDE ANGLE LENS

19

PRT-16279

PRT-16279

SparkFun

ARDUINO NANO STACKABLE HEADERS

400

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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