Accessories

Image Part Number Description / PDF Quantity Rfq
PRT-14059

PRT-14059

SparkFun

SMARTIPI TOUCH

10

KIT-16389

KIT-16389

SparkFun

DLI KIT (WITHOUT JETSON NANO)

9

PRT-10474

PRT-10474

SparkFun

XT60 CONNECTORS MALE/FEMALE PAIR

3552

PRT-08272

PRT-08272

SparkFun

2MM 10PIN XBEE SOCKET

0

PRT-14428

PRT-14428

SparkFun

QWIIC CABLE - 200MM

386

PRT-14425

PRT-14425

SparkFun

QWIIC CABLE - BREADBOARD JUMPER

613

SEN-08733

SEN-08733

SparkFun

INFRARED SENSOR JUMPER WIRE 3POS

0

WIG-17265

WIG-17265

SparkFun

8BITDO LITE BLUETOOTH GAMEPAD -

24

CAB-09556

CAB-09556

SparkFun

BUS PIRATE CABLE

115

PRT-17252

PRT-17252

SparkFun

MICRO:BIT EDGE CONNECTOR - PTH,

0

COM-08033

COM-08033

SparkFun

BUTTON PAD 4X4 - BREAKOUT PCB

0

DEV-09215

DEV-09215

SparkFun

AVR PROGRAMMING CABLE

36

COM-14572

COM-14572

SparkFun

SMARTIPI TOUCH BACK COVER LARGE

3

WIG-17266

WIG-17266

SparkFun

8BITDO LITE BLUETOOTH GAMEPAD -

25

PRT-13925

PRT-13925

SparkFun

TEENSY HEADER KIT

43

PRT-14417

PRT-14417

SparkFun

QWIIC JST CONNECTOR - SMD 4-PIN

0

KIT-16549

KIT-16549

SparkFun

MICROMOD DIY CARRIER KIT 5PACK

242

PRT-14299

PRT-14299

SparkFun

MICRO:BIT BATTERY HOLDER - 2XAA

0

PRT-17152

PRT-17152

SparkFun

TEENSY STACKABLE HEADER KIT (EXT

110

PRT-14017

PRT-14017

SparkFun

RASPBERRY PI GPIO TALL HEADER

1185

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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