Accessories

Image Part Number Description / PDF Quantity Rfq
102990062

102990062

Seeed

LOGIC PIRATE

0

114992266

114992266

Seeed

IMX219-160 REPLACEMENT CAMERA MO

40

114020163

114020163

Seeed

GROVE FEMALE HEADER 20PACK

599

110990210

110990210

Seeed

GROVE 4PIN MALE JUMPERS 5PACK

441

114991495

114991495

Seeed

GROVE/BEAGLEBONEBLUE 4PIN 10PACK

72

110990028

110990028

Seeed

GROVE 4PIN FEMALE JUMPERS 5PACK

338

114020102

114020102

Seeed

GROVE RIVET 2.1MM DIA 30PACK

0

112990086

112990086

Seeed

EMMC MODULE 16G FOR ROCK PI 4

0

110990092

110990092

Seeed

GROVE I2C BRANCH CABLES 5PACK

33

114020162

114020162

Seeed

GROVE FEMALE HEADER R/A 600PACK

0

114992067

114992067

Seeed

RF EXPLORER RPI TOUCH SCREEN HOL

63

316010012

316010012

Seeed

GALVANOMETER MOTOR (SC17-15K)

0

317990279

317990279

Seeed

USB CP2102 SERIAL CONVERTER

41

114020161

114020161

Seeed

GROVE FEMALE HEADER 600PACK

0

114020164

114020164

Seeed

GROVE FEMALE HEADER R/A 20PACK

51

110990031

110990031

Seeed

GROVE 4PIN CABLES 5PACK 20CM

86

106990006

106990006

Seeed

ATX BREAKOUT BOARD BENCH POWER S

18

110990442

110990442

Seeed

CRAZYFLIE 2.0 FEMALE CONN 10POS

0

114020101

114020101

Seeed

GROVE NYLON SCREW & NUT (20SETS)

95

103990443

103990443

Seeed

EMMC MODULE ADAPTER FOR ROCK PI

14

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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