Accessories

Image Part Number Description / PDF Quantity Rfq
110990040

110990040

Seeed

GROVE 4PIN CABLES 5PACK 30CM

121

103990444

103990444

Seeed

EMMC READER FOR ROCK PI 4

48

112990088

112990088

Seeed

EMMC MODULE 64G FOR ROCK PI 4

0

110060009

110060009

Seeed

STARTER BUNDLE HARNESS

0

114991496

114991496

Seeed

GROVE/BEAGLEBONEBLUE 6PIN 10PACK

23

112990087

112990087

Seeed

EMMC MODULE 32G FOR ROCK PI 4

0

102990044

102990044

Seeed

OPEN WORKBENCH LOGIC SNIFFER

0

110990027

110990027

Seeed

GROVE 4PIN CABLES 5PCS 20CM

359

110990038

110990038

Seeed

GROVE 4PIN CABLES 5PACK 50CM

0

110990000

110990000

Seeed

BUS PIRATE V4 PROBE KIT

15

321070032

321070032

Seeed

RASPBERRY PI B+ 40-26PIN CBL

0

110990036

110990036

Seeed

GROVE 4PIN CABLES 5PACK 5CM

0

114992267

114992267

Seeed

IMX219-77 REPLACEMENT CAMERA MOD

28

114991790

114991790

Seeed

CORAL USB ACCELERATOR

0

110990030

110990030

Seeed

GROVE 2MM 4PIN VERT CONN 10PCS

379

110990064

110990064

Seeed

GROVE 4PIN CABLES 5PACK 40CM

0

112990089

112990089

Seeed

EMMC MODULE 128G FOR ROCK PI 4

0

110990037

110990037

Seeed

GROVE 2MM 4PIN R/A CONN 10PACK

1238

114090054

114090054

Seeed

INTELLIGENT ROBOT REMOTE CONTROL

0

110990041

110990041

Seeed

BUS PIRATE V3 PROBE KIT

39

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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