Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
76-HIFD22

76-HIFD22

NTE Electronics, Inc.

HEAT SHRINK INS FEM DISC

680

76-FT16

76-FT16

NTE Electronics, Inc.

NON INS FLAG TERM 16-14WG

8222

76-IMD22-250C

76-IMD22-250C

NTE Electronics, Inc.

PVC INS MALE DISCON 22-18 100 BA

11

76-MD16-187

76-MD16-187

NTE Electronics, Inc.

NON INS MALE DISCONNECT

895

76-MD16L

76-MD16L

NTE Electronics, Inc.

NON INS MALE DISCONNECT 50 BAG

0

76-FD22-187L

76-FD22-187L

NTE Electronics, Inc.

NON INS FEM DISCON 22-18G 50 BAG

8

76-NIFD22-110C

76-NIFD22-110C

NTE Electronics, Inc.

NYLON INS FEMALE DISCONN 100 BAG

2

76-NIMD12-250L

76-NIMD12-250L

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT 50 BAG

5

76-NIMD22-187L

76-NIMD22-187L

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT 50 BAG

3

76-MD22-110C

76-MD22-110C

NTE Electronics, Inc.

NON INS MALE DISCONNECT 100 BAG

4

76-IPD12L

76-IPD12L

NTE Electronics, Inc.

PVC INS PIGGYBACK DISCONN 50 BAG

13

76-NFIFD16

76-NFIFD16

NTE Electronics, Inc.

NYLON FULLY INS FEM DISC

3804

76-NIFD16-187

76-NIFD16-187

NTE Electronics, Inc.

NYLON INS FEMALE DISCONN

15254

76-FT16L

76-FT16L

NTE Electronics, Inc.

NON INS FLAG TERM 16-14WG 50 BAG

4

76-FIFD22-187

76-FIFD22-187

NTE Electronics, Inc.

PVC FULLY INS FEM DISCON

6123

76-NIMD16-187

76-NIMD16-187

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT

0

76-IMD16-110C

76-IMD16-110C

NTE Electronics, Inc.

PVC INS MALE DISCON 16-14 100 BA

5

76-NIFT22C

76-NIFT22C

NTE Electronics, Inc.

NYLON INS FLAG TERM 22-18 100 BA

4

76-NIPD12C

76-NIPD12C

NTE Electronics, Inc.

NYLON INS PIGGYBACK DISC 100 BA

0

76-NIMD22-110

76-NIMD22-110

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT

409

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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