Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
76-FT12

76-FT12

NTE Electronics, Inc.

NON INS FLAG TERM 12-10WG

0

76-IFD16-187L

76-IFD16-187L

NTE Electronics, Inc.

PVC INS FEMALE DISCONNECT 50 BAG

11

76-MD16-187L

76-MD16-187L

NTE Electronics, Inc.

NON INS MALE DISCONNECT 50 BAG

2

76-NIFD22-250

76-NIFD22-250

NTE Electronics, Inc.

NYLON INS FEMALE DISCONN

2248

76-NIFT22L

76-NIFT22L

NTE Electronics, Inc.

NYLON INS FLAG TERM 22-18 50 BAG

1

76-HIMD16L

76-HIMD16L

NTE Electronics, Inc.

HEAT SHRINK INS MALE DISC 50 BAG

6

76-MD12

76-MD12

NTE Electronics, Inc.

NON INS MALE DISCONNECT

240

76-FIFD16-250

76-FIFD16-250

NTE Electronics, Inc.

PVC FULLY INS FEM DISCON

1406

76-FIFD22-110L

76-FIFD22-110L

NTE Electronics, Inc.

PVC FULLY INS FEM DISCON 50 BAG

15

76-NIMD16-187L

76-NIMD16-187L

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT 50 BAG

0

76-FD22-110

76-FD22-110

NTE Electronics, Inc.

NON INS FEM DISCON 22-18G

8438

76-HIMD22

76-HIMD22

NTE Electronics, Inc.

HEAT SHRINK INS MALE DISC

1719

76-FD16-187L

76-FD16-187L

NTE Electronics, Inc.

NON INS FEM DISCON 16-14G 50 BAG

0

76-FD16-110C

76-FD16-110C

NTE Electronics, Inc.

NON INS FEM DISCON 16-14G 100 BA

1

76-FIFD16-187L

76-FIFD16-187L

NTE Electronics, Inc.

PVC FULLY INS FEM DISCON 50 BAG

16

76-IPD16C

76-IPD16C

NTE Electronics, Inc.

PVC INS PIGGYBACK DISCONN 100 BA

8

76-IMD22-250L

76-IMD22-250L

NTE Electronics, Inc.

PVC INS MALE DISCON 22-18 50 BAG

2

76-HIMD16

76-HIMD16

NTE Electronics, Inc.

HEAT SHRINK INS MALE DISC

2402

76-NIFD22-110L

76-NIFD22-110L

NTE Electronics, Inc.

NYLON INS FEMALE DISCONN 50 BAG

11

76-NFIMD22L

76-NFIMD22L

NTE Electronics, Inc.

NYLON FULLY INS MALE DISC 50 BAG

5

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

RFQ BOM Call Skype Email
Top