Terminal Blocks - Headers, Plugs and Sockets

Image Part Number Description / PDF Quantity Rfq
TBP01P1W-508-10BE

TBP01P1W-508-10BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

557

TBP01R1-508-10BE

TBP01R1-508-10BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

1240

TBP02R1W-381-10BE

TBP02R1W-381-10BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

550

TBP02R1-381-09BE

TBP02R1-381-09BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

199

TBP02P1W-381-16BE

TBP02P1W-381-16BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

2

TBP02R2-381-04BE

TBP02R2-381-04BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

1595

TBP01R2-508-16BE

TBP01R2-508-16BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

1211

TBP01R2W-508-12BE

TBP01R2W-508-12BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

377

TBP01P1-508-24BE

TBP01P1-508-24BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08

579

TBP01R1-508-03BE

TBP01R1-508-03BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

4495

TBP01R2-508-08BE

TBP01R2-508-08BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

1512

TBP01R2-508-03BE

TBP01R2-508-03BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

2839

TBP01R1W-508-08BE

TBP01R1W-508-08BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

564

TBP01P1-508-12BE

TBP01P1-508-12BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08

409

TBP01R2W-508-06BE

TBP01R2W-508-06BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

262

TBP01R1W-508-04BE

TBP01R1W-508-04BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

1331

TBP02R2-381-03BE

TBP02R2-381-03BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

3276

TBP01P1-508-16BE

TBP01P1-508-16BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08

1101

TBP02R1W-381-06BE

TBP02R1W-381-06BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

360

TBP01P1-508-07BE

TBP01P1-508-07BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08

291

Terminal Blocks - Headers, Plugs and Sockets

1. Overview

Terminal blocks, headers, plugs, and sockets are essential components in electrical and electronic systems for establishing reliable connections between circuits. These devices enable signal transmission, power distribution, and system modularity. Their standardized designs ensure interoperability, scalability, and ease of maintenance in complex systems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Terminal Blocks Screw/clamp-based connections for high current/ voltage Industrial control panels, power distribution units
PCB Headers Pin/grid arrays for board-to-board connections Embedded systems, Arduino shields
RJ Connectors Modular jacks for data/telecom signals Ethernet networks (RJ45), telephone systems (RJ11)
D-Sub Connectors Multi-pin trapezoidal shells for analog/digital signals Legacy serial interfaces, industrial sensors
USB Connectors Hot-pluggable interfaces for power/data Consumer electronics, peripheral devices

3. Structure and Components

Typical structures include:

  • Insulating housing (PA66, PBT, or LCP plastics)
  • Contact elements (phosphor bronze, beryllium copper)
  • Plating materials (gold, tin, nickel for corrosion resistance)
  • Actuation mechanisms (screws, spring clamps, or friction fits)
  • EMI shielding layers (for high-frequency applications)

4. Key Technical Specifications

Parameter Importance
Current Rating (A) Determines power handling capacity
Voltage Rating (V) Defines dielectric strength requirements
Contact Resistance (m ) Impacts signal integrity and power loss
Insertion Loss (dB) Critical for high-speed data transmission
Mating Cycles Indicates mechanical durability
Operating Temperature (- C to + C) Defines environmental tolerance

5. Application Fields

Primary industries include:

  • Industrial automation (PLCs, HMIs)
  • Telecommunications (5G base stations, routers)
  • Consumer electronics (smartphones, wearables)
  • Medical equipment (imaging devices, patient monitors)
  • Automotive (EV charging systems, ADAS)

6. Leading Manufacturers and Products

Manufacturer Representative Product
Phoenix Contact COMBICON series terminal blocks
TE Connectivity MICRO MATCH connectors
Molex SL Series headers
Amphenol D-Subminiature connectors
Samtec QTE high-speed socket systems

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • Mechanical constraints (space, vibration)
  • Environmental factors (temperature, humidity)
  • Signal integrity needs (frequency, noise rejection)
  • Cost vs. reliability trade-offs
  • Compliance with standards (IPC, IEC, UL)

8. Industry Trends

Emerging developments include:

  • Miniaturization for wearable devices
  • High-speed connectors for 5G/6G ( 25 Gbps)
  • Hybrid connectors integrating power/data
  • Eco-friendly materials (halogen-free, RoHS compliant)
  • Smart connectors with built-in sensors
  • Automotive-grade connectors for EVs

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