Terminal Blocks - Headers, Plugs and Sockets

Image Part Number Description / PDF Quantity Rfq
TBP01P1W-508-04BE

TBP01P1W-508-04BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

100

TBP02R1W-381-16BE

TBP02R1W-381-16BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

503

TBP01R2-508-06BE

TBP01R2-508-06BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

1580

TBP02R1W-381-12BE

TBP02R1W-381-12BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

432

TBP01R1-508-14BE

TBP01R1-508-14BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

426

TBP02P1W-381-05BE

TBP02P1W-381-05BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

443

TBP02R2W-381-08BE

TBP02R2W-381-08BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

196

TBP01R2-508-10BE

TBP01R2-508-10BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

393

TBP02P1-381-10BE

TBP02P1-381-10BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

1103

TBP01R2-508-14BE

TBP01R2-508-14BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

274

TBP01P1W-508-05BE

TBP01P1W-508-05BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, W SCR

372

TBP02R2-381-07BE

TBP02R2-381-07BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

452

TBP02P1-381-08BE

TBP02P1-381-08BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

1007

TBP02R2-381-02BE

TBP02R2-381-02BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

5237

TBP02P1-381-09BE

TBP02P1-381-09BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

808

TBP02P1-381-02BE

TBP02P1-381-02BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

103

TBP01P1-508-04BE

TBP01P1-508-04BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08

0

TBP02P1W-381-12BE

TBP02P1W-381-12BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

451

TBP01R1-508-16BE

TBP01R1-508-16BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 5.08,

343

TBP02R1-381-05BE

TBP02R1-381-05BE

CUI Devices

TERMINAL BLOCK, PLUGGABLE, 3.81,

2098

Terminal Blocks - Headers, Plugs and Sockets

1. Overview

Terminal blocks, headers, plugs, and sockets are essential components in electrical and electronic systems for establishing reliable connections between circuits. These devices enable signal transmission, power distribution, and system modularity. Their standardized designs ensure interoperability, scalability, and ease of maintenance in complex systems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Terminal Blocks Screw/clamp-based connections for high current/ voltage Industrial control panels, power distribution units
PCB Headers Pin/grid arrays for board-to-board connections Embedded systems, Arduino shields
RJ Connectors Modular jacks for data/telecom signals Ethernet networks (RJ45), telephone systems (RJ11)
D-Sub Connectors Multi-pin trapezoidal shells for analog/digital signals Legacy serial interfaces, industrial sensors
USB Connectors Hot-pluggable interfaces for power/data Consumer electronics, peripheral devices

3. Structure and Components

Typical structures include:

  • Insulating housing (PA66, PBT, or LCP plastics)
  • Contact elements (phosphor bronze, beryllium copper)
  • Plating materials (gold, tin, nickel for corrosion resistance)
  • Actuation mechanisms (screws, spring clamps, or friction fits)
  • EMI shielding layers (for high-frequency applications)

4. Key Technical Specifications

Parameter Importance
Current Rating (A) Determines power handling capacity
Voltage Rating (V) Defines dielectric strength requirements
Contact Resistance (m ) Impacts signal integrity and power loss
Insertion Loss (dB) Critical for high-speed data transmission
Mating Cycles Indicates mechanical durability
Operating Temperature (- C to + C) Defines environmental tolerance

5. Application Fields

Primary industries include:

  • Industrial automation (PLCs, HMIs)
  • Telecommunications (5G base stations, routers)
  • Consumer electronics (smartphones, wearables)
  • Medical equipment (imaging devices, patient monitors)
  • Automotive (EV charging systems, ADAS)

6. Leading Manufacturers and Products

Manufacturer Representative Product
Phoenix Contact COMBICON series terminal blocks
TE Connectivity MICRO MATCH connectors
Molex SL Series headers
Amphenol D-Subminiature connectors
Samtec QTE high-speed socket systems

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • Mechanical constraints (space, vibration)
  • Environmental factors (temperature, humidity)
  • Signal integrity needs (frequency, noise rejection)
  • Cost vs. reliability trade-offs
  • Compliance with standards (IPC, IEC, UL)

8. Industry Trends

Emerging developments include:

  • Miniaturization for wearable devices
  • High-speed connectors for 5G/6G ( 25 Gbps)
  • Hybrid connectors integrating power/data
  • Eco-friendly materials (halogen-free, RoHS compliant)
  • Smart connectors with built-in sensors
  • Automotive-grade connectors for EVs

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