Terminal Blocks - Headers, Plugs and Sockets

Image Part Number Description / PDF Quantity Rfq
EM221816H

EM221816H

PowerStor (Eaton)

TERM BLOCK HDR 16POS 5.08MM

0

EM331502

EM331502

PowerStor (Eaton)

TERM BLOCK HEADER

0

EM248505

EM248505

PowerStor (Eaton)

TERMINAL BLOCK

0

EM248506

EM248506

PowerStor (Eaton)

TERMINAL BLOCK

0

EM248507

EM248507

PowerStor (Eaton)

TERMINAL BLOCK

0

EM248508

EM248508

PowerStor (Eaton)

TERMINAL BLOCK

0

EM258101V

EM258101V

PowerStor (Eaton)

TERM BLOCK HEADER

0

EM248503

EM248503

PowerStor (Eaton)

TERMINAL BLOCK

0

EM248502

EM248502

PowerStor (Eaton)

TERMINAL BLOCK

0

EM248504

EM248504

PowerStor (Eaton)

TERMINAL BLOCK

0

Terminal Blocks - Headers, Plugs and Sockets

1. Overview

Terminal blocks, headers, plugs, and sockets are essential components in electrical and electronic systems for establishing reliable connections between circuits. These devices enable signal transmission, power distribution, and system modularity. Their standardized designs ensure interoperability, scalability, and ease of maintenance in complex systems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Terminal Blocks Screw/clamp-based connections for high current/ voltage Industrial control panels, power distribution units
PCB Headers Pin/grid arrays for board-to-board connections Embedded systems, Arduino shields
RJ Connectors Modular jacks for data/telecom signals Ethernet networks (RJ45), telephone systems (RJ11)
D-Sub Connectors Multi-pin trapezoidal shells for analog/digital signals Legacy serial interfaces, industrial sensors
USB Connectors Hot-pluggable interfaces for power/data Consumer electronics, peripheral devices

3. Structure and Components

Typical structures include:

  • Insulating housing (PA66, PBT, or LCP plastics)
  • Contact elements (phosphor bronze, beryllium copper)
  • Plating materials (gold, tin, nickel for corrosion resistance)
  • Actuation mechanisms (screws, spring clamps, or friction fits)
  • EMI shielding layers (for high-frequency applications)

4. Key Technical Specifications

Parameter Importance
Current Rating (A) Determines power handling capacity
Voltage Rating (V) Defines dielectric strength requirements
Contact Resistance (m ) Impacts signal integrity and power loss
Insertion Loss (dB) Critical for high-speed data transmission
Mating Cycles Indicates mechanical durability
Operating Temperature (- C to + C) Defines environmental tolerance

5. Application Fields

Primary industries include:

  • Industrial automation (PLCs, HMIs)
  • Telecommunications (5G base stations, routers)
  • Consumer electronics (smartphones, wearables)
  • Medical equipment (imaging devices, patient monitors)
  • Automotive (EV charging systems, ADAS)

6. Leading Manufacturers and Products

Manufacturer Representative Product
Phoenix Contact COMBICON series terminal blocks
TE Connectivity MICRO MATCH connectors
Molex SL Series headers
Amphenol D-Subminiature connectors
Samtec QTE high-speed socket systems

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • Mechanical constraints (space, vibration)
  • Environmental factors (temperature, humidity)
  • Signal integrity needs (frequency, noise rejection)
  • Cost vs. reliability trade-offs
  • Compliance with standards (IPC, IEC, UL)

8. Industry Trends

Emerging developments include:

  • Miniaturization for wearable devices
  • High-speed connectors for 5G/6G ( 25 Gbps)
  • Hybrid connectors integrating power/data
  • Eco-friendly materials (halogen-free, RoHS compliant)
  • Smart connectors with built-in sensors
  • Automotive-grade connectors for EVs

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