| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Weidmuller |
HEADER COUPLER 5.08MM 18POS OR |
0 |
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Weidmuller |
RS-AY/040 CBL INTERFACE |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 17POS BK |
0 |
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Weidmuller |
RS-FCN40B-G4 FUJITSU INTERFA |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 21POS OR |
0 |
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Weidmuller |
RS-MR 34B-L4 CBL INTERFACE |
0 |
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Weidmuller |
RS-F16/ODX MISU CBL INTFAC |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 7POS BK |
0 |
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Weidmuller |
RS-FCN40B-L4 FUJITSU INTERFA |
0 |
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Weidmuller |
RS-F16/IDX MISU CBL INTER |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 23POS BK |
0 |
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Weidmuller |
RS-MR 20 S HONDA MALE |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 11POS OR |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 16POS BK |
0 |
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Weidmuller |
RS-FCN16S-L4 FUJITSU INTERFA |
0 |
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Weidmuller |
RS PLC AI W/F 1771-IFE 8CH |
0 |
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Weidmuller |
RS-MSC/0 40 CBL INTERFACE |
0 |
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Weidmuller |
RS-MR 34S-G4 HONDA MALE |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 24POS OR |
0 |
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Weidmuller |
HEADER COUPLER 5.08MM 22POS OR |
0 |
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Terminal blocks and adapters are modular electronic components designed to establish secure electrical connections between wires, printed circuit boards (PCBs), or systems. These devices ensure reliable signal transmission, power distribution, and system modularity across diverse applications. Their importance in modern technology lies in enabling flexible wiring configurations, simplifying maintenance, and ensuring compatibility between disparate electrical systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Board-to-Board Adapters | Direct PCB interconnection without wires, high-density pin layouts | Servers, industrial control panels |
| Wire-to-Board Adapters | Connects discrete wires to PCBs, screw/clamp termination options | Automation equipment, HVAC systems |
| Modular Terminal Blocks | Customizable with fuses, circuit breakers, or signal conditioning | Factory automation, renewable energy systems |
| High-Voltage Adapters | Extended creepage distances, reinforced insulation | Power distribution units, medical equipment |
| RF/Coaxial Adapters | Impedance-matched designs for high-frequency signals | Telecom infrastructure, test equipment |
Typical terminal blocks and adapters consist of: - Dielectric Housing: Thermoplastic (PA66, PBT) or metal alloys with UL94 V-0 flammability rating - Contact Elements: Phosphor bronze or beryllium copper with plating (gold, tin, silver) - Termination Mechanism: Screw terminals (M2-M6), spring clamps, or IDC (Insulation Displacement Contact) - Locking Features: Mechanical latches, anti-vibration screws, or push-pull coupling
| Parameter | Typical Range | Importance |
|---|---|---|
| Current Rating | 0.1A - 100A | Determines power handling capacity |
| Voltage Rating | 50V - 1500V | Ensures dielectric strength |
| Contact Resistance | 1-20m | Impacts signal integrity |
| Insulation Resistance | 100M - 10G | Prevents leakage currents |
| Operating Temperature | -60 C - +150 C | Material stability indicator |
| IP Rating | IP20 - IP68 | Environmental protection level |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Phoenix Contact | PTFIX series | Push-in wire connection, 8kV surge protection |
| TE Connectivity | MicroSpeed Plus | 0.8mm pitch, 10Gbps data rate |
| Wago | 285 Series | CAGE CLAMP technology, vibration-resistant |
| Molex | MX150 | Hybrid power/signal transmission |
| Weidm ller | OMNIMATE PCB | UL/CSA/IEC certifications, 24AWG-10AWG range |
Consider the following factors during selection: - Electrical requirements (current/voltage levels) - Environmental conditions (temperature, humidity, vibration) - Space constraints and mounting orientation - Compatibility with existing wiring/cabling infrastructure - Maintenance requirements and tooling needs - Cost-performance balance for production volumes
Key developments shaping the market: - Miniaturization for compact IoT devices (sub-1.0mm pitch connectors) - Increased demand for high-speed data interfaces (USB4, PCIe 5.0) - Integration with smart diagnostics (built-in current/voltage sensors) - Adoption of eco-friendly materials (halogen-free polymers) - Growth in modular design approaches for rapid system reconfiguration - Enhanced EMI/RFI shielding for 5G and automotive applications