Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
2141-1X10G00SA Oupiin	PCB SOCKET, SINGLE ROW, 10 PINS,	867
2044-1X12G00SA Oupiin	PCB SOCKET, SINGLE ROW, 12 PIN,	0
2047-2X13G00S3U Oupiin	PCB SOCKET, DOUBLE ROW, 26 PINS,	407
2048-1X03G00BU Oupiin	PCB SOCKET, SINGLE ROW, 3 PINS,	840
2047-2X10G00S3U Oupiin	PCB SOCKET, DOUBLE ROW, 20 PIN,	256
2145-2X10C30DPT-S Oupiin	PCB SOCKET, DOUBLE ROW, 20 PIN,	0
2048-2X13G00DU Oupiin	PCB SOCKET, DOUBLE ROW, 26 PINS,	700
2141-1X05G00SB Oupiin	PCB SOCKET, SINGLE ROW, 5 PINS,	2056
2042-1X10G00SA Oupiin	PCB SOCKET, SINGLE ROW, 10 PIN,	3345
2047-1X17G00S8U Oupiin	PCB SOCKET, SINGLE ROW, 17 PINS,	495
2143-2X10G00DPU Oupiin	PCB SOCKET, DOUBLE ROW, 20 PIN,	0
2048-2X10G00EU Oupiin	PCB SOCKET, DOUBLE ROW, 20 PINS,	990
2043-1X10G00SA Oupiin	PCB SOCKET, SINGLE ROW, 10 PIN,	1055
2041-1X40G00SA Oupiin	PCB SOCKET, SINGLE ROW, 40 PIN,	540
2044-1X11G00SA Oupiin	PCB SOCKET, SINGLE ROW, 11 PIN,	83
2043-A2X08G10DPT-H3.5-M Oupiin	PCB SOCKET, A SERIES, DOUBLE ROW	0
2044-1X07G00SA Oupiin	PCB SOCKET, SINGLE ROW, 7 PIN, S	3263
2242-2X08C00DT-P Oupiin	PCB SOCKET, DOUBLE ROW, 16 PIN,	2642
2041-2X04G00SB Oupiin	PCB SOCKET, DOUBLE ROW, 8 PIN, S	900
2044-1X09G00SA Oupiin	PCB SOCKET, SINGLE ROW, 9 PIN, S	1310

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers