Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
2242-2X25G00DT-P Oupiin	PCB SOCKET, DOUBLE ROW, 50 PIN,	1000
2143-2X17G00DPU Oupiin	PCB SOCKET, DOUBLE ROW, 24 PIN,	0
2044-2X03TSB Oupiin	PCB SOCKET, DOUBLE ROW, 6 PIN, T	0
2047-2X05G00S3U Oupiin	PCB SOCKET, DOUBLE ROW, 10 PIN,	608
2044-1X08G00SA Oupiin	PCB SOCKET, SINGLE ROW, 8 PIN, S	620
2141-2X05G00SB Oupiin	PCB SOCKET, DOUBLE ROW, 10 PINS,	697
2042-1X05G00RB Oupiin	PCB SOCKET, SINGLE ROW, 5 PIN, R	1438
2043-2X12G00DNT-P Oupiin	PCB SOCKET, DOUBLE ROW, 24 PIN,	800
2044-2X16G00SA Oupiin	PCB SOCKET, DOUBLE ROW, STRAIGHT	908
2046-40G00SA Oupiin	PCB SOCKET, 40 PIN, STRAIGHT.8.5	520
2042-2X06G00RB Oupiin	PCB SOCKET, DOUBLE ROW, 12 PIN,	175
2044-1X04G00SB Oupiin	PCB SOCKET, SINGLE ROW, 4 PIN, S	1592
2141-2X18G00SA Oupiin	PCB SOCKET, DOUBLE ROW, 36 PIN,	1386
2043-A2X09G00DNU-H3.5 Oupiin	PCB SOCKET, A SERIES, DOUBLE ROW	0
2047-2X25G00S3U Oupiin	PCB SOCKET, DOUBLE ROW, 50 PINS,	2502
2141-1X20G00SA Oupiin	PCB SOCKER, SINGLE ROW, 20 PIN,	630
2042-1X08G00SA Oupiin	PCB SOCKET, SINGLE ROW, 8 PIN, S	0
9391-A4S96CB30DA Oupiin	HIGH POWER AND SIGNAL CONNECTOR,	13
2042-1X15G00SA Oupiin	PCB SOCKET, SINGLE ROW, 15 PIN,	708
9391-A2P02S08CB30PA Oupiin	HIGH POWER AND SIGNAL CONNECTOR,	3

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers