Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
M55-6022642R Harwin	CONN RCPT 26POS 0.05 GOLD SMD	545
G125-FS11605F2P Harwin	CONN RCPT 16POS 0.049 GOLD SMD	50
M50-3102545 Harwin	CONN RCPT 50POS 0.05 GOLD SMD	11
M50-3200545 Harwin	CONN RCPT 10P 0.05 GOLD PCB R/A	2023
M22-6550442R Harwin	CONN RCPT 8P 0.079 GOLD SMD R/A	1818
M52-5010645 Harwin	CONN RCPT 6POS 0.05 GOLD PCB	761
G125-FS11205F2P Harwin	CONN RCPT 12POS 0.049 GOLD SMD	50
M20-7880546 Harwin	CONN RCPT 10POS 0.1 TIN PCB R/A	353
G125-FV15005L0P Harwin	CONN RCPT 50POS 0.049 GOLD PCB	46
M20-7820946 Harwin	CONN RCPT 9POS 0.1 TIN PCB	0
M20-7810245R Harwin	CONN RCPT 4POS 0.1 GOLD SMD	0
G125-FV11605L0P Harwin	CONN RCPT 16POS 0.049 GOLD PCB	242
G125-FS10605L0P Harwin	CONN RCPT 6POS 0.049 GOLD SMD	1146
M50-4300645 Harwin	CONN RCPT 12POS 0.05 GOLD SMD	1176
M20-7830846 Harwin	CONN RCPT 16POS 0.1 TIN PCB	0
M20-7880842 Harwin	CONN RCPT 16POS 0.1 GOLD PCB R/A	0
M55-6101242R Harwin	CONN RCPT 12P 0.05 GOLD SMD R/A	700
M55-6011642R Harwin	CONN RCPT 16POS 0.05 GOLD SMD	217
M20-7920842R Harwin	CONN RCPT 16POS 0.1 GOLD SMD R/A	430
M40-3101045R Harwin	CONN RCPT 20POS 0.039 GOLD SMD	2772

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers