Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
G125-FS11205L0P Harwin	CONN RCPT 12POS 0.049 GOLD SMD	285
M22-6341042 Harwin	CONN RCPT 20POS 0.079 GOLD SMD	1669
M20-7893646 Harwin	CONN RCPT 36POS 0.1 TIN PCB R/A	0
G125-FS15005F2P Harwin	CONN RCPT 50POS 0.049 GOLD SMD	37
M50-3140245R Harwin	CONN RCPT 2POS 0.05 GOLD SMD	1867
M80-8870805 Harwin	CONN RCPT 8POS 0.079 GOLD PCB	1016
G125-FS12605F1P Harwin	CONN RCPT 26POS 0.049 GOLD SMD	1
M80-4002642 Harwin	CONN RCPT 26POS 0.079 GOLD PCB	519
G125-FV10605F1P Harwin	CONN RCPT 6POS 0.049 GOLD PCB	2591
G125-FV13405F3P Harwin	CONN RCPT 34POS 0.049 GOLD PCB	7
M20-7810545R Harwin	CONN RCPT 10POS 0.1 GOLD SMD	0
M80-7076305 Harwin	CONN RCPT 63POS 0.079 GOLD PCB	0
M80-6811442 Harwin	CONN RCPT 14POS 0.079 GOLD SMD	98
M80-8501245 Harwin	CONN RCPT 12POS 0.079 GOLD PCB	257
M55-6012042R Harwin	CONN RCPT 20POS 0.05 GOLD SMD	144
M52-5000845 Harwin	CONN RCPT 8POS 0.05 GOLD PCB	582
M20-7820242 Harwin	CONN RCPT 2POS 0.1 GOLD PCB	1402
M52-5000745 Harwin	CONN RCPT 7POS 0.05 GOLD PCB	1268
M20-7820842 Harwin	CONN RCPT 8POS 0.1 GOLD PCB	773
M50-3140545 Harwin	CONN RCPT 5POS 0.05 GOLD SMD	357

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers