Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
5025850670 Woodhead - Molex	CONN RCPT 6POS 0.059 TIN SMD R/A	0
0009483116 Woodhead - Molex	CONN RCPT 11POS 0.156 GOLD PCB	0
0447640401 Woodhead - Molex	CONN RCPT 4POS 0.118 TIN PCB R/A	1007
0872645052 Woodhead - Molex	CONN RCPT 50P 0.079 GOLD PCB R/A	131
5054051270 Woodhead - Molex	CONN RCPT 12POS 0.059 GOLD SMD	2491
0022142164 Woodhead - Molex	CONN RCPT 16POS 0.1 TIN PCB	6068
0015247240 Woodhead - Molex	CONN RCPT 24POS 0.165 TIN PCB	591
5024941070 Woodhead - Molex	CONN RCPT 10P 0.079 TIN SMD R/A	1749
0022182071 Woodhead - Molex	CONN RCPT 7POS 0.1 GOLD PCB	0
5024430970 Woodhead - Molex	CONN RCPT 9POS 0.079 TIN SMD	47
5019314070 Woodhead - Molex	CONN RCPT 40POS 0.049 GOLD SMD	1410
0447640402 Woodhead - Molex	CONN RCPT 4P 0.118 GOLD PCB R/A	2389
0447690401 Woodhead - Molex	CONN RCPT 4POS 0.118 TIN PCB	0
5031481690 Woodhead - Molex	CONN RCPT 16P 0.059 TIN SMD R/A	265
0038001428 Woodhead - Molex	CONN RCPT 8POS 0.1 TIN PCB	0
0448120028 Woodhead - Molex	CONN RCPT 10POS 0.1 GOLD PCB	804
0901471107 Woodhead - Molex	CONN RCPT 7POS 0.1 TIN PCB	1632
0022027103 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB	5617
5023860670 Woodhead - Molex	CONN RCPT 6POS 0.049 TIN SMD R/A	2197
0447691802 Woodhead - Molex	CONN RCPT 18POS 0.118 GOLD PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers