Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0432550147 Woodhead - Molex	CONN HDR 9POS 0.25 TIN PCB	0
5031543290 Woodhead - Molex	CONN RCPT 32POS 0.059 TIN SMD	3490
0015247100 Woodhead - Molex	CONN RCPT 10POS 0.165 TIN PCB	300
5024941270 Woodhead - Molex	CONN RCPT 12P 0.079 TIN SMD R/A	983
5025851570 Woodhead - Molex	CONN RCPT 15P 0.059 TIN SMD R/A	2260
0791077005 Woodhead - Molex	CONN RCPT 12POS 0.079 GOLD PCB	2817
0010844022 Woodhead - Molex	CONN HDR 2POS 0.25 TIN PCB	7813
0009481074 Woodhead - Molex	CONN RCPT 7P 0.156 TIN EDGE MNT	77
0447642401 Woodhead - Molex	CONN RCPT 24P 0.118 TIN PCB R/A	826
5031482490 Woodhead - Molex	CONN RCPT 24P 0.059 TIN SMD R/A	1268
0015247140 Woodhead - Molex	CONN RCPT 14POS 0.165 TIN PCB	2383
5054060860 Woodhead - Molex	CONN RCPT 8POS 0.059 GOLD SMD	7637
0901471103 Woodhead - Molex	CONN RCPT 3POS 0.1 TIN PCB	1202
0015247060 Woodhead - Molex	CONN RCPT 6POS 0.165 TIN PCB	0
5023821072 Woodhead - Molex	CONN RCPT 10POS 0.049 TIN SMD	3315
0447692201 Woodhead - Molex	CONN RCPT 22POS 0.118 TIN PCB	0
5054050470 Woodhead - Molex	CONN RCPT 4POS 0.059 GOLD SMD	5699
0009483086 Woodhead - Molex	CONN RCPT 8POS 0.156 GOLD PCB	0
5023820671 Woodhead - Molex	CONN RCPT 6POS 0.049 GOLD SMD	5660
0022142104 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB	796

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers