Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
5023860970 Woodhead - Molex	CONN RCPT 9POS 0.049 TIN SMD R/A	4798
0447691401 Woodhead - Molex	CONN RCPT 14POS 0.118 TIN PCB	0
0022152046 Woodhead - Molex	CONN RCPT 4POS 0.1 TIN EDGE MNT	815
0015247064 Woodhead - Molex	CONN RCPT 6POS 0.165 TIN PCB	0
0791091024 Woodhead - Molex	CONN RCPT 50POS 0.079 GOLD SMD	372
0447690601 Woodhead - Molex	CONN RCPT 6POS 0.118 TIN PCB	1883
5024430570 Woodhead - Molex	CONN RCPT 5POS 0.079 TIN SMD	12290
0010101061 Woodhead - Molex	CONN RCPT 6POS 0.2 TIN EDGE MNT	244
0022182101 Woodhead - Molex	CONN RCPT 10POS 0.1 GOLD PCB	717
0015445864 Woodhead - Molex	CONN RCPT 64POS 0.1 GOLD PCB	783
5023860271 Woodhead - Molex	CONN RCPT 2P 0.049 GOLD SMD R/A	6443
0038001339 Woodhead - Molex	CONN RCPT 9POS 0.1 TIN EDGE MNT	1543
0873681424 Woodhead - Molex	CONN RCPT 14P 0.079 GOLD SMD R/A	412
0015247181 Woodhead - Molex	CONN RCPT 18POS 0.165 TIN PCB	10
0791077008 Woodhead - Molex	CONN RCPT 18POS 0.079 GOLD PCB	314
0009483084 Woodhead - Molex	CONN RCPT 8POS 0.156 GOLD PCB	116
0022182061 Woodhead - Molex	CONN RCPT 6POS 0.1 GOLD PCB	1728
5031590200 Woodhead - Molex	CONN RCPT 2POS 0.059 TIN PCB	23208
0022173102 Woodhead - Molex	CONN RCPT 10POS 0.1 GOLD PCB	20
0791077024 Woodhead - Molex	CONN RCPT 50POS 0.079 GOLD PCB	1123

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers