Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
0791077014

0791077014

Woodhead - Molex

CONN RCPT 30POS 0.079 GOLD PCB

0

0022027033

0022027033

Woodhead - Molex

CONN RCPT 3POS 0.1 TIN PCB

2865

0791098402

0791098402

Woodhead - Molex

CONN RCPT 6POS 0.079 GOLD SMD

307

0009483065

0009483065

Woodhead - Molex

CONN RCPT 6P 0.156 GOLD EDGE MNT

629

0009483025

0009483025

Woodhead - Molex

CONN RCPT 2P 0.156 GOLD EDGE MNT

1691

0873684624

0873684624

Woodhead - Molex

CONN RCPT 46P 0.079 GOLD SMD R/A

0

5025850970

5025850970

Woodhead - Molex

CONN RCPT 9POS 0.059 TIN SMD R/A

2887

0460100421

0460100421

Woodhead - Molex

CONN RCPT 4POS 0.165 TIN PCB

590

5024940370

5024940370

Woodhead - Molex

CONN RCPT 3POS 0.079 TIN SMD R/A

809

0009482121

0009482121

Woodhead - Molex

CONN RCPT 12P 0.156 TIN EDGE MNT

462

0009483104

0009483104

Woodhead - Molex

CONN RCPT 10POS 0.156 GOLD PCB

4063

0009483095

0009483095

Woodhead - Molex

CONN RCPT 9P 0.156 GOLD EDGE MNT

0

0901481104

0901481104

Woodhead - Molex

CONN RCPT 4POS 0.1 TIN PCB R/A

919

0038001334

0038001334

Woodhead - Molex

CONN RCPT 4POS 0.1 TIN EDGE MNT

1124

0872630623

0872630623

Woodhead - Molex

CONN RCPT 6POS 0.079 GOLD SMD

6059

2132260410

2132260410

Woodhead - Molex

CONN RECPT R/A SMC 4 POS

891

0901481106

0901481106

Woodhead - Molex

CONN RCPT 6POS 0.1 TIN PCB R/A

439

0009483114

0009483114

Woodhead - Molex

CONN RCPT 11POS 0.156 GOLD PCB

0

5020464070

5020464070

Woodhead - Molex

CONN RCPT 40P 0.049 GOLD SMD R/A

1965

0015247183

0015247183

Woodhead - Molex

CONN RCPT 18POS 0.165 GOLD PCB

1628

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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