| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
CONN HDR 4POS 0.1 STACK T/H TIN |
0 |
|
|
Woodhead - Molex |
CONN HDR 50POS 0.079 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 4POS 0.079 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 9POS 0.156 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 50POS 0.1 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 24POS 0.079 STACK SMD |
0 |
|
|
Woodhead - Molex |
CONN HDR 20POS 0.1 STACK T/H TIN |
0 |
|
|
Woodhead - Molex |
CONN HDR 12POS 0.1 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 20POS 0.1 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 8POS 0.098 STACK T/H |
0 |
|
|
Woodhead - Molex |
CONN HDR 10POS 0.1 STACK T/H TIN |
0 |
|
|
Woodhead - Molex |
CONN HDR 10POS 0.079 STACK SMD |
0 |
|
|
Woodhead - Molex |
CONN HDR 1POS STACK T/H TIN |
0 |
|
|
Woodhead - Molex |
CONN HDR 6POS 0.079 STACK SMD |
0 |
|
|
Woodhead - Molex |
CONN HDR 26POS 0.079 STACK SMD |
0 |
|
|
Woodhead - Molex |
CONN HDR 8POS 0.1 STACK T/H TIN |
0 |
|
Rectangular board spacers and stackers are interconnect solutions designed to establish mechanical and electrical connections between two or more printed circuit boards (PCBs). These connectors maintain precise spacing while enabling signal/power transmission. Their importance in modern electronics includes enabling compact designs, modular system architectures, and reliable high-speed data transfer in applications ranging from consumer devices to industrial equipment.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Board Spacers | Fixed pitch, non-mating interconnects with insulating pillars | Smartphone mid-frames, IoT sensor modules |
| Stacking Connectors | Self-mating design with compressible contacts | Embedded computing boards, FPGA development kits |
| High-Speed Stackers | Controlled impedance, low crosstalk design | 5G base stations, network switches |
| Compliant Pin Stackers | Press-fit terminations for Z-axis compliance | Automotive radar systems, medical imaging devices |
Typical construction includes:
| Parameter | Typical Range | Importance |
|---|---|---|
| Current Rating | 0.5A - 5A per contact | Dictates power delivery capability |
| Contact Resistance | 5-20m | Impacts signal integrity |
| Dielectric Strength | 500V - 2500V AC | Ensures electrical safety |
| Operating Temperature | -55 C to +125 C | Determines environmental robustness |
| Insertion Force | 0.5N - 5N per contact | Affects assembly process |
| Mating Cycles | 500 - 10,000 cycles | Defines service life expectancy |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| TE Connectivity | SMART Board Stacker | 12 Gbps capability, self-aligning |
| Molex | Impel High-Speed Connector | 25+ Gbps, floating compliance |
| Amphenol | CBGA Interposer | Micro BGA footprint compatibility |
| JAE Electronics | DF59 Series | 0.4mm pitch, 0.3mm stack height |
Key considerations:
Case Study: In automotive camera module design, compliant pin stackers reduced assembly time by 40% while maintaining ISO 16750 vibration compliance.