Rectangular Connectors - Board Spacers, Stackers (Board to Board)

Image Part Number Description / PDF Quantity Rfq
0879371602

0879371602

Woodhead - Molex

CONN HDR 16POS 0.1 STACK T/H TIN

0

0874471503

0874471503

Woodhead - Molex

CONN HDR 15POS 0.156 STACK T/H

0

0877610001

0877610001

Woodhead - Molex

CONN HDR 10POS 0.079 STACK T/H

350

0879370502

0879370502

Woodhead - Molex

CONN HDR 5POS 0.1 STACK T/H TIN

0

0879520003

0879520003

Woodhead - Molex

CONN HDR 6POS 0.1 STACK TH RA

0

0877971002

0877971002

Woodhead - Molex

CONN HDR 10POS 0.1 STACK T/H

0

1510330400

1510330400

Woodhead - Molex

CONN HDR 4POS 0.079 STACK SMD

0

0877971200

0877971200

Woodhead - Molex

CONN HDR 12POS 0.1 STACK T/H

0

0874471002

0874471002

Woodhead - Molex

CONN HDR 10POS 0.156 STACK T/H

0

0877971800

0877971800

Woodhead - Molex

CONN HDR 18POS 0.1 STACK T/H

0

0877620010

0877620010

Woodhead - Molex

CONN HDR 26POS 0.079 STACK SMD

0

0879371601

0879371601

Woodhead - Molex

CONN HDR 16POS 0.1 STACK T/H

0

1510171001

1510171001

Woodhead - Molex

2MM CUSTOM HDR DRDW T/H 10CKT

0

0877621655

0877621655

Woodhead - Molex

CONN HDR 16POS 0.079 STACK SMD

0

0877620006

0877620006

Woodhead - Molex

CONN HDR 24POS 0.079 STACK SMD

0

0877611000

0877611000

Woodhead - Molex

CONN HDR 10POS 0.079 STACK T/H

0

0877615022

0877615022

Woodhead - Molex

CONN HDR 50POS 0.079 STACK T/H

0

0877620024

0877620024

Woodhead - Molex

CONN HDR 12POS 0.079 STACK SMD

0

0879371206

0879371206

Woodhead - Molex

CONN HDR 12POS 0.1 STACK T/H TIN

0

0877610007

0877610007

Woodhead - Molex

CONN HDR 6POS 0.079 STACK T/H

0

Rectangular Connectors - Board Spacers, Stackers (Board to Board)

1. Overview

Rectangular board spacers and stackers are interconnect solutions designed to establish mechanical and electrical connections between two or more printed circuit boards (PCBs). These connectors maintain precise spacing while enabling signal/power transmission. Their importance in modern electronics includes enabling compact designs, modular system architectures, and reliable high-speed data transfer in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Board SpacersFixed pitch, non-mating interconnects with insulating pillarsSmartphone mid-frames, IoT sensor modules
Stacking ConnectorsSelf-mating design with compressible contactsEmbedded computing boards, FPGA development kits
High-Speed StackersControlled impedance, low crosstalk design5G base stations, network switches
Compliant Pin StackersPress-fit terminations for Z-axis complianceAutomotive radar systems, medical imaging devices

3. Structure and Components

Typical construction includes:

  • Insulating housing (LCP/PBT with UL94 V-0 rating)
  • Phosphor bronze or beryllium copper contacts
  • Gold-plated contact areas (0.5-3 m thickness)
  • Polarization keying to prevent misalignment
  • Integrated locking mechanisms (latches/snap-fits)
  • Optional EMI shielding layers

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating0.5A - 5A per contactDictates power delivery capability
Contact Resistance5-20m Impacts signal integrity
Dielectric Strength500V - 2500V ACEnsures electrical safety
Operating Temperature-55 C to +125 CDetermines environmental robustness
Insertion Force0.5N - 5N per contactAffects assembly process
Mating Cycles500 - 10,000 cyclesDefines service life expectancy

5. Application Fields

  • Telecommunications: Server backplanes, 5G NR radios
  • Industrial Automation: PLC modules, CNC controller stacks
  • Consumer Electronics: Foldable device hinge connectors
  • Medical Devices: MRI system detector arrays
  • Automotive: ADAS sensor stacking modules

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivitySMART Board Stacker12 Gbps capability, self-aligning
MolexImpel High-Speed Connector25+ Gbps, floating compliance
AmphenolCBGA InterposerMicro BGA footprint compatibility
JAE ElectronicsDF59 Series0.4mm pitch, 0.3mm stack height

7. Selection Recommendations

Key considerations:

  • Electrical requirements vs. contact density needs
  • Stack height tolerance stack-up analysis
  • Thermal expansion coefficient matching
  • Field serviceability requirements
  • Automated optical inspection (AOI) compatibility

Case Study: In automotive camera module design, compliant pin stackers reduced assembly time by 40% while maintaining ISO 16750 vibration compliance.

8. Industry Trends

  • Migration to 0.3mm pitch connectors for mobile applications
  • Integration of coaxial contacts for RF board-to-board links
  • Adoption of additive manufacturing for complex shapes
  • Increased adoption of press-fit terminations in harsh environments
  • Development of hybrid optical-electrical stacking solutions
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