| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Storage & Server IO (Amphenol ICC) |
CONN IDC 50POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 10POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 10POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 26POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 20POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 26POS PCB |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 20POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 16POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 10POS PCB |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 34POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 60POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 10POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 16POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 34POS PCB |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 10POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 14POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 50POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 40POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN IDC 40POS VERT |
0 |
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Storage & Server IO (Amphenol ICC) |
CONN DIP HDR IDC 10POS VERT |
0 |
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Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Vertical Board In | Perpendicular PCB stacking with high mating force tolerance | Smartphones, industrial control panels |
| Right-Angle Board In | 90 PCB interconnection for space-constrained designs | Automotive infotainment systems |
| Direct Wire to Board (Crimp) | Field-terminable contacts with crimped wire connections | Home appliances, medical devices |
| Direct Wire to Board (Solder) | High-reliability solder terminations for fixed wiring | Aerospace electronics, test equipment |
Typical construction includes:
| Parameter | Significance | Typical Values |
|---|---|---|
| Current Rating | Determines power transmission capacity | 0.5A-15A/contact |
| Dielectric Withstanding Voltage | Safety isolation performance | 500VAC-2500VAC |
| Contact Resistance | Signal integrity indicator | 5-20m (initial) |
| Operating Temperature | Environmental durability range | -55 C to +125 C |
| Mating Cycle Life | Long-term reliability metric | 500-10,000 cycles |
Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.
| Manufacturer | Product Line | Key Specifications |
|---|---|---|
| TE Connectivity | MicroSpeed Direct Wire | 0.8mm pitch, 3Gbps data rate, 1000V isolation |
| Molex | SlimStack Wire-to-Board | 1.25mm pitch, 3A current, 200 cycle durability |
| Amphenol | ECOS Board In | Surface-mount compliant, 1.0mm wire capacity |
Key considerations include:
Emerging developments include: