1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

3. Structure and Components

Typical construction includes:

• Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
• Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
• Polarization Features: Keying slots and color coding for mating assurance
• Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
• Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

5. Application Fields

• Consumer Electronics: Laptop docking stations, gaming consoles
• Automotive: Powertrain control modules, ADAS sensors
• Industrial: PLC racks, CNC machine interfaces
• Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

7. Selection Guidelines

Key considerations include:

• Current/voltage requirements vs. contact cross-section area
• Wire gauge compatibility (typically 30-16AWG)
• Environmental sealing needs (IP65+ for industrial applications)
• Automated assembly compatibility (press-fit vs. solder options)
• Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

• Miniaturization: 0.4mm pitch connectors for wearable devices
• High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
• Material Innovation: Biodegradable PBT for RoHS compliance
• Smart Manufacturing: Embedded sensors for predictive maintenance
• Automotive Focus: 800V EV connector systems with active thermal management