Rectangular Connectors - Board In, Direct Wire to Board

Image Part Number Description / PDF Quantity Rfq
009177001601196

009177001601196

Elco (AVX)

CONN WIRE IDC

0

538702106022096

538702106022096

Elco (AVX)

CONN IDC

0

538702104024096

538702104024096

Elco (AVX)

CONN IDC

0

538702203018096

538702203018096

Elco (AVX)

CONN IDC

0

009176003722996

009176003722996

Elco (AVX)

CONN WIRE IDC

0

009176001722906

009176001722906

Elco (AVX)

CONN WIRE IDC

0

538702205020096

538702205020096

Elco (AVX)

CONN IDC

0

009176002711906

009176002711906

Elco (AVX)

CONN WIRE IDC

0

538702201020096

538702201020096

Elco (AVX)

CONN IDC

0

538702201024096

538702201024096

Elco (AVX)

CONN IDC

0

589296001000019

589296001000019

Elco (AVX)

CONN WIR POKE-IN

0

009176001863406

009176001863406

Elco (AVX)

CONN WIRE IDC 1POS 24AWG SMD

0

538702204020096

538702204020096

Elco (AVX)

CONN IDC

0

589296003001999

589296003001999

Elco (AVX)

CONN WIR POKE-IN

0

538702106024096

538702106024096

Elco (AVX)

CONN IDC

0

009176003722906

009176003722906

Elco (AVX)

CONN WIRE IDC

0

009296001603606

009296001603606

Elco (AVX)

CONN WIRE POKE-IN

0

009176002711196

009176002711196

Elco (AVX)

CONN WIRE IDC

0

009176001701896

009176001701896

Elco (AVX)

CONN WIRE IDC

0

009176001853906

009176001853906

Elco (AVX)

CONN WIRE IDC 1POS 22AWG SMD

698217000

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Vertical Board InPerpendicular PCB stacking with high mating force toleranceSmartphones, industrial control panels
Right-Angle Board In90 PCB interconnection for space-constrained designsAutomotive infotainment systems
Direct Wire to Board (Crimp)Field-terminable contacts with crimped wire connectionsHome appliances, medical devices
Direct Wire to Board (Solder)High-reliability solder terminations for fixed wiringAerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

  • Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
  • Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
  • Polarization Features: Keying slots and color coding for mating assurance
  • Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
  • Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

ParameterSignificanceTypical Values
Current RatingDetermines power transmission capacity0.5A-15A/contact
Dielectric Withstanding VoltageSafety isolation performance500VAC-2500VAC
Contact ResistanceSignal integrity indicator5-20m (initial)
Operating TemperatureEnvironmental durability range-55 C to +125 C
Mating Cycle LifeLong-term reliability metric500-10,000 cycles

5. Application Fields

  • Consumer Electronics: Laptop docking stations, gaming consoles
  • Automotive: Powertrain control modules, ADAS sensors
  • Industrial: PLC racks, CNC machine interfaces
  • Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

ManufacturerProduct LineKey Specifications
TE ConnectivityMicroSpeed Direct Wire0.8mm pitch, 3Gbps data rate, 1000V isolation
MolexSlimStack Wire-to-Board1.25mm pitch, 3A current, 200 cycle durability
AmphenolECOS Board InSurface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

  • Current/voltage requirements vs. contact cross-section area
  • Wire gauge compatibility (typically 30-16AWG)
  • Environmental sealing needs (IP65+ for industrial applications)
  • Automated assembly compatibility (press-fit vs. solder options)
  • Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for wearable devices
  • High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
  • Material Innovation: Biodegradable PBT for RoHS compliance
  • Smart Manufacturing: Embedded sensors for predictive maintenance
  • Automotive Focus: 800V EV connector systems with active thermal management
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