Rectangular Connectors - Board In, Direct Wire to Board

Image Part Number Description / PDF Quantity Rfq
009176002722996

009176002722996

Elco (AVX)

CONN WIRE IDC

0

538702101020096

538702101020096

Elco (AVX)

CONN IDC

0

009176001883906

009176001883906

Elco (AVX)

CONN WIRE IDC

0

009176003701806

009176003701806

Elco (AVX)

CONN WIRE IDC

0

538702201022096

538702201022096

Elco (AVX)

CONN IDC

0

009176003711996

009176003711996

Elco (AVX)

CONN WIRE IDC

0

009176001853406

009176001853406

Elco (AVX)

CONN WIRE IDC 1POS 22AWG SMD

0

009296005212906

009296005212906

Elco (AVX)

CONN WIRE POKE-IN

0

538702204018096

538702204018096

Elco (AVX)

CONN IDC

0

538702102024096

538702102024096

Elco (AVX)

CONN IDC

0

009176003711196

009176003711196

Elco (AVX)

CONN WIRE IDC

0

009176002722906

009176002722906

Elco (AVX)

CONN WIRE IDC

0

538702208020096

538702208020096

Elco (AVX)

CONN IDC

1500

009176002732996

009176002732996

Elco (AVX)

CONN WIRE IDC

0

009176001884806

009176001884806

Elco (AVX)

CONN WIRE IDC 1POS 28AWG SMD

0

538702202024096

538702202024096

Elco (AVX)

CONN IDC

0

009176002712906

009176002712906

Elco (AVX)

CONN WIRE IDC

0

009175003701896

009175003701896

Elco (AVX)

CONN WIRE IDC

0

538702205024096

538702205024096

Elco (AVX)

CONN IDC

0

009176001863906

009176001863906

Elco (AVX)

CONN WIRE IDC 1POS 24AWG SMD

1343

Rectangular Connectors - Board In, Direct Wire to Board

1. Overview

Rectangular connectors with Board In and Direct Wire to Board configurations are standardized electro-mechanical interfaces designed for high-density electrical connections between printed circuit boards (PCBs) or between wires and PCBs. Board In connectors feature male/female contacts mounted directly onto PCBs for board-to-board stacking, while Direct Wire to Board connectors enable termination of discrete wires to PCBs without intermediate harnesses. These connectors are critical in modern electronics for enabling compact designs, reliable signal/power transmission, and modular system architectures across industries such as consumer electronics, automotive, and industrial automation.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Vertical Board InPerpendicular PCB stacking with high mating force toleranceSmartphones, industrial control panels
Right-Angle Board In90 PCB interconnection for space-constrained designsAutomotive infotainment systems
Direct Wire to Board (Crimp)Field-terminable contacts with crimped wire connectionsHome appliances, medical devices
Direct Wire to Board (Solder)High-reliability solder terminations for fixed wiringAerospace electronics, test equipment

3. Structure and Components

Typical construction includes:

  • Insulating Housing: Thermoplastic (e.g., LCP, PBT) or thermoset materials with UL94 V-0 flammability rating
  • Contact Elements: Phosphor bronze or beryllium copper with Au/Ni plating (0.05-0.76 m Au thickness)
  • Polarization Features: Keying slots and color coding for mating assurance
  • Retention Mechanism: Integral latches or threaded hardware (M2-M4 screws)
  • Shielding: Optional EMI suppression via stamped metal cans (100MHz-10GHz attenuation)

4. Key Technical Specifications

ParameterSignificanceTypical Values
Current RatingDetermines power transmission capacity0.5A-15A/contact
Dielectric Withstanding VoltageSafety isolation performance500VAC-2500VAC
Contact ResistanceSignal integrity indicator5-20m (initial)
Operating TemperatureEnvironmental durability range-55 C to +125 C
Mating Cycle LifeLong-term reliability metric500-10,000 cycles

5. Application Fields

  • Consumer Electronics: Laptop docking stations, gaming consoles
  • Automotive: Powertrain control modules, ADAS sensors
  • Industrial: PLC racks, CNC machine interfaces
  • Medical: Diagnostic imaging equipment, patient monitors

Case Study: TE Connectivity's 1-104846-2 connector used in automotive engine control units achieves IP67 sealing with direct wire-to-board termination of 22-28AWG sensor cables.

6. Leading Manufacturers and Representative Products

ManufacturerProduct LineKey Specifications
TE ConnectivityMicroSpeed Direct Wire0.8mm pitch, 3Gbps data rate, 1000V isolation
MolexSlimStack Wire-to-Board1.25mm pitch, 3A current, 200 cycle durability
AmphenolECOS Board InSurface-mount compliant, 1.0mm wire capacity

7. Selection Guidelines

Key considerations include:

  • Current/voltage requirements vs. contact cross-section area
  • Wire gauge compatibility (typically 30-16AWG)
  • Environmental sealing needs (IP65+ for industrial applications)
  • Automated assembly compatibility (press-fit vs. solder options)
  • Signal integrity requirements (impedance control for >1Gbps applications)

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for wearable devices
  • High-Speed Transmission: Differential pair designs supporting USB4/PCIe 5.0
  • Material Innovation: Biodegradable PBT for RoHS compliance
  • Smart Manufacturing: Embedded sensors for predictive maintenance
  • Automotive Focus: 800V EV connector systems with active thermal management
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