Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
RJX8FB6HRYB

RJX8FB6HRYB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FD6HB

RJX8FD6HB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FA5VB

RJX8FA5VB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB6VGREB

RJX8FB6VGREB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5HGRB

RJX8FB5HGRB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB5VEB

RJX8FB5VEB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB6HRGB

RJX8FB6HRGB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5VB

RJX8FB5VB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB5VUUB

RJX8FB5VUUB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB6HGYEB

RJX8FB6HGYEB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FD6110

RJX8FD6110

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PNL

0

RJX8FB5HGREB

RJX8FB5HGREB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB5HRREB

RJX8FB5HRREB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FD5HB

RJX8FD5HB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FD3VB

RJX8FD3VB

Tuchel / Amphenol

CONN JACK 1PORT 100 BASE-T PCB

0

RJX8FB6VGYB

RJX8FB6VGYB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FA6VB

RJX8FA6VB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB6HGRB

RJX8FB6HGRB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5VGYB

RJX8FB5VGYB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FA6HB

RJX8FA6HB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

RFQ BOM Call Skype Email
Top