Modular Connectors - Jacks With Magnetics

Image Part Number Description / PDF Quantity Rfq
RJX8FB5HRYEB

RJX8FB5HRYEB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB5HUUEB

RJX8FB5HUUEB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FD5110

RJX8FD5110

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PNL

0

RJX8FB5VGREB

RJX8FB5VGREB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB5VUUEB

RJX8FB5VUUEB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB6VRYB

RJX8FB6VRYB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FA3HB

RJX8FA3HB

Tuchel / Amphenol

CONN JACK 1PORT 100 BASE-T PCB

0

RJX8FB6VRRB

RJX8FB6VRRB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB6HEB

RJX8FB6HEB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB6HUUB

RJX8FB6HUUB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB6VEB

RJX8FB6VEB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB6VRGB

RJX8FB6VRGB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5VRRB

RJX8FB5VRRB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB6VB

RJX8FB6VB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5HEB

RJX8FB5HEB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FD6VB

RJX8FD6VB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5VRYB

RJX8FB5VRYB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

RJX8FB6HGYB

RJX8FB6HGYB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB6VGRB

RJX8FB6VGRB

Tuchel / Amphenol

CONN JACK 1PORT 10G BASE-T PCB

0

RJX8FB5HRYB

RJX8FB5HRYB

Tuchel / Amphenol

CONN JACK 1PORT 1000 BASE-T PCB

0

Modular Connectors - Jacks With Magnetics

1. Overview

Modular connectors with integrated magnetics are hybrid components combining standard modular jack interfaces (e.g., RJ45) with built-in magnetic circuits. These devices enable signal transmission while providing galvanic isolation and noise suppression. They are critical in Ethernet communications, industrial networking, and telecommunication systems where signal integrity and electromagnetic compatibility (EMC) are essential.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
RJ45 MagJackIntegrated common-mode chokes, 10/100/1000BASE-T supportEthernet switches, routers
Surface Mount MagJackLow-profile SMD design, reduced PCB footprintIndustrial IoT devices
High-Speed MagJackUp to 10GBASE-T support, optimized for <1GHz frequenciesData center servers
POE-Enabled MagJackSupports Power-over-Ethernet (PoE/PoE+)IP cameras, VoIP phones

3. Structure and Components

Typical construction includes: - Plastic housing (LCP/PBT materials) with integrated latch mechanism - Precision-machined copper alloy contacts (gold-plated for durability) - Toroidal magnetic cores for common-mode noise suppression - PCB mounting terminals with insulation displacement design - Shielding cage for EMI protection in high-speed variants

4. Key Technical Specifications

ParameterTypical ValueImportance
Frequency Range100MHz-1GHzDetermines data transmission rate
Insulation Resistance>1G Ensures electrical safety
Rated Current1.5A per contactPOE power handling capability
VSWR<1.3:1Measures signal integrity
Mechanical Life500-1000 mating cyclesProduct durability

5. Application Fields

Primary applications across: - Telecommunications: Central office switches, DSLAMs - Industrial Automation: PLCs, SCADA systems - Consumer Electronics: Smart TVs, gaming consoles - Transportation: In-vehicle networking, railway control systems - Medical Devices: MRI machines, patient monitoring equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE Connectivity1-1418809-310GBASE-T support, -40 C to +85 C rating
Amphenol51001001Integrated LED indicators, PoE++ compatible
Molex0878650011Shielded design, 1.27mm pitch SMD
Bel Stewart94330101EAuto-transformer function, UL94 V-0 rating

7. Selection Guidelines

Key considerations: 1. Electrical Requirements: Match data rate and PoE specifications 2. Mechanical Constraints: Check PCB footprint and mating dimensions 3. Environmental Factors: Temperature range and humidity resistance 4. Compliance: Verify IEEE 802.3 and RoHS certifications 5. Cost-Performance Ratio: Balance durability with budget limitations

8. Industry Trends

Current development trends include: - Migration to 25/100GBASE-T for data centers - Miniaturization for mobile device integration - Enhanced PoE support (up to 71W) - Integration with active circuitry (smart jacks) - Development of eco-friendly lead-free soldering solutions

RFQ BOM Call Skype Email
Top