Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
0441702006

0441702006

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

0441700003

0441700003

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

0855135003

0855135003

Woodhead - Molex

CONN MOD JACK 6P4C VERT UNSHLD

0

0432028825

0432028825

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

0015438507

0015438507

Woodhead - Molex

CONN MOD JACK 8P4C R/A UNSHLD

0

0050836016

0050836016

Woodhead - Molex

SEMCONN SHLD VRCPT PCB 16CKT

0

0438410004

0438410004

Woodhead - Molex

CONN MOD JACK 6P4C R/A UNSHLD

0

0424108936

0424108936

Woodhead - Molex

CONN MOD JACK 8P4C VERT UNSHLD

0

0424109226

0424109226

Woodhead - Molex

CONN MOD JACK 8P2C VERT UNSHLD

0

0442480061

0442480061

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

0

0424108792

0424108792

Woodhead - Molex

CONN MOD JACK 8P6C VERT UNSHLD

0

0428786360

0428786360

Woodhead - Molex

CONN MOD JACK 6P4C VERT UNSHLD

0

0452050001

0452050001

Woodhead - Molex

CONN MOD JACK 6P6C R/A SHIELDED

0

0442480002

0442480002

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

0

0015438588

0015438588

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

0

0437436102

0437436102

Woodhead - Molex

CONN MOD JACK 6P4C R/A UNSHLD

0

0432024104

0432024104

Woodhead - Molex

CONN MOD JACK 4P2C R/A UNSHLD

0

0432238104

0432238104

Woodhead - Molex

CONN MOD JACK 8P10C R/A UNSHLD

0

0438410016

0438410016

Woodhead - Molex

CONN MOD JACK 6P2C R/A UNSHLD

0

0428789418

0428789418

Woodhead - Molex

CONN MOD JACK 8P2C VERT UNSHLD

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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