Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
0428788984

0428788984

Woodhead - Molex

CONN MOD JACK 8P4C VERT UNSHLD

0

0432028910

0432028910

Woodhead - Molex

CONN MOD JACK 8P10C R/A SHIELDED

0

0424108888

0424108888

Woodhead - Molex

CONN MOD JACK 8P4C VERT UNSHLD

0

0432236004

0432236004

Woodhead - Molex

CONN MOD JACK 6P6C R/A UNSHLD

0

0432236043

0432236043

Woodhead - Molex

CONN MOD JACK 6P2C R/A UNSHLD

0

0955222441

0955222441

Woodhead - Molex

CONN MOD JACK 4P4C VERT UNSHLD

0

0432238131

0432238131

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

0

0951222882

0951222882

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

0438603003

0438603003

Woodhead - Molex

CONN MODULAR JACK RA

0

0432498102

0432498102

Woodhead - Molex

CONN MOD JACK 8P10C R/A UNSHLD

0

0441440009

0441440009

Woodhead - Molex

CONN MOD JACK 6P4C R/A UNSHLD

0

0015830306

0015830306

Woodhead - Molex

CONN MOD JACK 6P6C R/A UNSHLD

0

0441440019

0441440019

Woodhead - Molex

CONN MOD JACK 6P2C R/A UNSHLD

0

0424109080

0424109080

Woodhead - Molex

CONN MOD JACK 8P4C VERT UNSHLD

0

0432238196

0432238196

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

0

0428789082

0428789082

Woodhead - Molex

CONN MOD JACK 8P4C VERT UNSHLD

0

0432236034

0432236034

Woodhead - Molex

CONN MOD JACK 6P4C R/A UNSHLD

0

0432028926

0432028926

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

0437436103

0437436103

Woodhead - Molex

CONN MODULAR JACK

0

0441500032

0441500032

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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