Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
TM5RQ-1414(50)

TM5RQ-1414(50)

Hirose

CONN MOD JACK COMBO R/A UNSHLD

100

TM1RV-623P64-35S-150M

TM1RV-623P64-35S-150M

Hirose

CONN MOD JACK 6P4C UNSHIELDED

2

MTJ-64YX1

MTJ-64YX1

Adam Tech

MODULAR JACK 6P4C

580

TM11R-5M2-88(01)

TM11R-5M2-88(01)

Hirose

CONN MOD JACK 8P8C R/A SHIELDED

17

1932219-1

1932219-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHLD

1580

GWLX-SMT-S988G/Y

GWLX-SMT-S988G/Y

Kycon

MOD JACK SMT 8P8C SHIELDED TOP/S

0

A-2004-1-4-R

A-2004-1-4-R

ASSMANN WSW Components

CONN MOD JACK 6P6C R/A UNSHLD

386

RJE58-188-5441

RJE58-188-5441

Storage & Server IO (Amphenol ICC)

RJ45 CAT5E STANDARD LEDS

565

0955012821

0955012821

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

47

GSX-NS7-88-3.05

GSX-NS7-88-3.05

Kycon

MODJK RT< 8P8C SHIELD TOP AND SI

0

MTJ-887X1

MTJ-887X1

Adam Tech

MODULAR JACK RJ45 8P8C

120

1-5406010-2

1-5406010-2

TE Connectivity AMP Connectors

CONN MOD JACK 6P6C R/A UNSHLD

2301

615006144121

615006144121

Würth Elektronik Midcom

CONN MOD JACK 6P6C VERT UNSHLD

148

0955012401

0955012401

Woodhead - Molex

CONN MOD JACK 4P4C R/A UNSHLD

9329

68897-001LF

68897-001LF

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 4P4C R/A UNSHLD

3043

KIT40846ZC

KIT40846ZC

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C SHIELDED

0

SS-651010S-A-NF

SS-651010S-A-NF

Stewart Connector

CONN MOD JACK 10P10C VERT SHLD

17664

0855135009

0855135009

Woodhead - Molex

CONN MOD JACK 8P8C VERT UNSHLD

0

GDWLX-PNS-88-G/Y

GDWLX-PNS-88-G/Y

Kycon

8P8C VERT. MOD JACK W/LED, GRN/Y

0

RJE4W4887411

RJE4W4887411

Storage & Server IO (Amphenol ICC)

8P8C, RA, CAT5E, STACKED 2X2, WI

180

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

RFQ BOM Call Skype Email
Top