Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
RJF7HA1B

RJF7HA1B

Socapex (Amphenol Pcd)

RJ FIELD HEX NUT RECEPT CORDSET

0

A20-108-262-310

A20-108-262-310

EDAC Inc.

CONN MOD JACK 8P8C R/A SHIELDED

0

A00-216-262-450

A00-216-262-450

EDAC Inc.

CONN MOD JACK 8P8C R/A SHIELDED

11606

5555164-4

5555164-4

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A UNSHLD

49140

0432028916

0432028916

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

101

1888653-5

1888653-5

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

200

A-2014-3-4-N-T-R

A-2014-3-4-N-T-R

ASSMANN WSW Components

CONN MOD JACK 4P4C VERT UNSHLD

5841

GWX-N-88

GWX-N-88

Kycon

8P8C MOD JACK ROHS COMPLIANT

0

GSGX-NS-4-88

GSGX-NS-4-88

Kycon

GANGJACK 4PORT RT< 8P8C SHIELD B

0

RJ11F72N

RJ11F72N

Socapex (Amphenol Pcd)

CONN MOD JACK 6P6C UNSHIELDED

0

6116173-4

6116173-4

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

SS-7288SFR1-A-NF

SS-7288SFR1-A-NF

Stewart Connector

CONN MOD JACK 8P8C R/A SHIELDED

0

73334-111LF

73334-111LF

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 6P6C R/A UNSHLD

588

09452451561

09452451561

HARTING

HARTING PUSHPULL V4 2.0 RJ45 CAT

0

0438600006

0438600006

Woodhead - Molex

CONN MOD JACK 6P4C R/A SHIELDED

196

TM1RV647AF88-35S-150M

TM1RV647AF88-35S-150M

Hirose

CONN MOD JACK 8P8C UNSHIELDED

3459

5406494-1

5406494-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

GMX-S-88

GMX-S-88

Kycon

CONN MOD JACK 8P8C R/A SHLD

258

RVAIJ2UEW-B24

RVAIJ2UEW-B24

Belden

JACK CAT 6A UTP RJ45 WHT 1=24

3

1-5406552-7

1-5406552-7

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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