Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
GMX-SMT2-N-101050

GMX-SMT2-N-101050

Kycon

FL/SMT M/JK LW/PROF RT<10P10C BL

0

0955402881

0955402881

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

0

FRJAE-488

FRJAE-488

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

1298

RJHSE538106

RJHSE538106

Storage & Server IO (Amphenol ICC)

8P8C, RA, SHIELD WITH TOP AND SI

240

EHRJ45P6SIDC

EHRJ45P6SIDC

Switchcraft / Conxall

CONN MOD JACK 8P8C R/A SHLD

261

5-1761183-3

5-1761183-3

TE Connectivity AMP Connectors

CONN MOD JACK 8P VERT SHLD

0

634108150321

634108150321

Würth Elektronik Midcom

WR-MJ_MODULAR JACKS_MID-MOUNT_SM

0

RJLSE4208101T

RJLSE4208101T

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

1120

RJHSEKP84

RJHSEKP84

Storage & Server IO (Amphenol ICC)

8P8C, VERTICAL, SHIELD WITH SIDE

1320

SS-7188VS-A-FLS

SS-7188VS-A-FLS

Stewart Connector

CONN MOD JACK 8P8C VERT SHIELDED

22

SS-60000-007

SS-60000-007

Stewart Connector

CONN MOD JACK 8P8C VERT UNSHLD

0

RJHSE3382

RJHSE3382

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C VERT SHIELDED

0

GMJXHT-MM-S-88-50TR

GMJXHT-MM-S-88-50TR

Kycon

8P8C MOD, JACK, MIDMOUNT, SHIELD

0

1149616

1149616

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

32

0438600027

0438600027

Woodhead - Molex

CONN MOD JACK 6P4C R/A SHIELDED

0

0847020005

0847020005

Woodhead - Molex

CONN MOD JACK 8P8C UNSHIELDED

0

RJHSE538B02

RJHSE538B02

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

20

09455451561

09455451561

HARTING

CONN MOD JACK 8P8C SHLD

0

SS71800-007F

SS71800-007F

Stewart Connector

CONN MOD JACK 8P8C R/A SHIELDED

280

TM5RJ3-64(50)

TM5RJ3-64(50)

Hirose

CONN MOD JACK 6P4C R/A SHLD

62

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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