Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
MRJ5381M1

MRJ5381M1

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

1100

MTJ-88TX1-FSD-LG

MTJ-88TX1-FSD-LG

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

258

PX0893

PX0893

Bulgin

CONN CAT6A COUPLER 8P8C TO 8P8C

434

RJE72-488-1451

RJE72-488-1451

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

0

SS-7188V-A-NF

SS-7188V-A-NF

Stewart Connector

CONN MOD JACK 8P8C VERT UNSHLD

2797

RJSAE-5385-02

RJSAE-5385-02

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

0

0445600001

0445600001

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

688

0855135109

0855135109

Woodhead - Molex

CONN MOD JACK 8P8C VERT UNSHLD

0

RJE49-188-1411

RJE49-188-1411

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8PC8PC R/A SHIELDE

65

0437438101

0437438101

Woodhead - Molex

CONN MOD JACK 8P8C R/A UNSHLD

0

RJHSE-538A

RJHSE-538A

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

1382

SS64800-031F

SS64800-031F

Stewart Connector

CONN MOD JACK

137

87180-088LF

87180-088LF

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

1083

TM5RJ2-88(50)

TM5RJ2-88(50)

Hirose

CONN MOD JACK 8P8C R/A UNSHLD

1518

TM2RE-1806(50)

TM2RE-1806(50)

Hirose

CONN MOD JACK 6P2C VERT UNSHLD

0

1085260000

1085260000

Weidmuller

CONN MOD JACK 8P8C SHIELDED

10

5558382-1

5558382-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

2176

5554990-1

5554990-1

TE Connectivity AMP Connectors

CONN MOD JACK 6P6C VERT UNSHLD

1623

0950097441

0950097441

Woodhead - Molex

CONN MOD JACK 4P4C R/A UNSHLD

0

EHRJ45P6IDC

EHRJ45P6IDC

Switchcraft / Conxall

CONN MOD JACK 8P8C R/A UNSHLD

122

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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