Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
RJF2PEM2G00

RJF2PEM2G00

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHIELDED

23

5558501-1

5558501-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A UNSHLD

482

RJHSE-5085-02

RJHSE-5085-02

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

723

5406545-1

5406545-1

TE Connectivity AMP Connectors

CONN MOD JACK 6P4C R/A UNSHLD

0

RJE73-188-00441

RJE73-188-00441

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

304

RJHSE508002

RJHSE508002

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

7856

6116640-1

6116640-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

0855135014

0855135014

Woodhead - Molex

CONN MOD JACK 6P6C VERT UNSHLD

0

RJHSE-3380

RJHSE-3380

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C VERT SHIELDED

1266

TM2RE-0606(50)

TM2RE-0606(50)

Hirose

CONN MOD JACK 6P6C VERT UNSHLD

1071

A-2004-1-4-LP-N-R

A-2004-1-4-LP-N-R

ASSMANN WSW Components

CONN MOD JACK 6P6C R/A UNSHLD

0

RV5IJ2UBK-B24

RV5IJ2UBK-B24

Belden

JACK CAT 5E UTP RJ45 BLK 1=24

3

5558067-1

5558067-1

TE Connectivity AMP Connectors

CONN MOD JACK 10P10C R/A SHLD

1741

GMX-SMT2-S7-88-50

GMX-SMT2-S7-88-50

Kycon

FL/SMT M/JK L/PRF RT< 8P8C SNAP

0

2-406549-5

2-406549-5

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

236

AX101321

AX101321

Belden

CONN MOD JACK 8P8C UNSHLD

8856

1091950

1091950

Phoenix Contact

RJ45 SOCKET INSERT, TYPE: RJ45,

72

09452151760

09452151760

HARTING

CONN MOD JACK

37

0855065001

0855065001

Woodhead - Molex

CONN MOD JACK 8P8C VERT UNSHLD

0

RJSAE538002

RJSAE538002

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

676

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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