Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
RJP5-10-0002

RJP5-10-0002

Stewart Connector

CONN MOD JACK 8P8C R/A SHIELDED

0

GMX-SMT2N101050TR

GMX-SMT2N101050TR

Kycon

FL/SMT M/JACK LOW/PROF RT<10P10C

0

MTJ-88TX1-FSD-LP

MTJ-88TX1-FSD-LP

Adam Tech

RJ45 MODULAR JACK, SHIELDED, DIP

156

1149855

1149855

Phoenix Contact

RJ45 SOCKET INSERT, DEGREE OF PR

59

0855135010

0855135010

Woodhead - Molex

CONN MOD JACK 6P6C VERT UNSHLD

0

RJSAE538404

RJSAE538404

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHLD

0

A-2014-2-4-R

A-2014-2-4-R

ASSMANN WSW Components

CONN MOD JACK 8P8C VERT UNSHLD

0

RJHSE-5381

RJHSE-5381

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

7471

RJFTV22G00

RJFTV22G00

Socapex (Amphenol Pcd)

CONN MOD JACK 8P8C UNSHIELDED

182

0432236107

0432236107

Woodhead - Molex

CONN MOD JACK 6P6C R/A UNSHLD

109

AX101066

AX101066

Belden

CONN MOD JACK 8P8C UNSHLD

210

2-406549-2

2-406549-2

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

2260

DCP-RJ6ST-RD

DCP-RJ6ST-RD

Switchcraft / Conxall

CONN MOD JACK 8P8C R/A SHIELDED

39

6339082-3

6339082-3

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

507

88400-064LF

88400-064LF

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 6P4C R/A UNSHLD

1395

RJHSE-5084

RJHSE-5084

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

2713

SS-60400-002

SS-60400-002

Stewart Connector

MOD RJ45 JACK VRT G/Y 4-40 UNC

397

SS71800-104G

SS71800-104G

Stewart Connector

CONN MOD JACK

0

17-10034

17-10034

CONEC

CONN MOD JACK 8P8C SHIELDED

14

A20-432-261-310

A20-432-261-310

EDAC Inc.

CONN MOD JACK 8P8C R/A SHIELDED

167

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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