Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
1042411221

1042411221

Woodhead - Molex

CONN NSIM SOCKET

0

0943515002

0943515002

Woodhead - Molex

MMC CONN W/EJECTOR 4 HIGH

0

1042730610

1042730610

Woodhead - Molex

CONN NANOSIM SOCKET 1.35H 2DIP

0

0472192021

0472192021

Woodhead - Molex

MICROSD HEADERHINGETYPE 20 U PLA

0

0473097285

0473097285

Woodhead - Molex

MICRO SD HEADER WITH D/C PIN

0

5008730816

5008730816

Woodhead - Molex

TFR CARD ASSY 8CKT EMBSTPPKG

0

0535241364

0535241364

Woodhead - Molex

CONN PCMCIA CARD PUSH-PUSH R/A

0

5024311011

5024311011

Woodhead - Molex

CONN MEMORY STICK STR TYPE 10CKT

0

0475792246

0475792246

Woodhead - Molex

CONN SD HDR 2.45 H/T DETECT PIN

0

1041770831

1041770831

Woodhead - Molex

CONNECTOR

0

0676873550

0676873550

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

0

0470191701

0470191701

Woodhead - Molex

SCALABLE SIM CONNECTOR 1.7 MM

0

5031820853

5031820853

Woodhead - Molex

CONN MICRO SD CARD PUSH-PUSH R/A

0

1042411211

1042411211

Woodhead - Molex

CONN NSIM SKT 1.45H 12P B-P

0

0538565020

0538565020

Woodhead - Molex

CF CARD SMT HEADER ASSY

0

0553295029

0553295029

Woodhead - Molex

CONN COMPACT FLASH CARD

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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